Lenovo 4XG7B02708 AMD EPYC 9455 48-Core Processor for ThinkSystem SR645 V3

Overview

The Lenovo 4XG7B02708 is a factory-configured AMD EPYC 9455 processor option for the ThinkSystem SR645 V3 platform. Rated at 48 cores, a 3.15GHz base clock, and a 300W TDP, this is a high-thread-count CPU aimed at workloads that scale with core density — virtualization hosts, parallel compute tasks, and data-intensive enterprise applications running on the SR645 V3 chassis. The kit ships without a heatsink or fan, so the required cooling accessory must be ordered separately before deployment.

Key Features

• 48 Cores / 300W TDP: High core count suits workloads that parallelize well — VM hosting, containerized environments, and multi-threaded analytics. The 300W envelope requires confirming your SR645 V3 chassis power delivery and cooling solution before ordering.
• 3.15GHz Base Clock: A meaningful base frequency for a 48-core part; latency-sensitive single-threaded tasks won't stall while the CPU is fully loaded across all cores.
• ThinkSystem SR645 V3 Platform Specific: The 4XG7B02708 is a Lenovo option part scoped to the SR645 V3 — verify socket and BIOS compatibility with your specific SR645 V3 configuration before purchasing a second processor for dual-socket builds.
• No Fan Included: This is a processor-only kit. The heatsink and fan module must be sourced separately. Skipping this step is the most common installation error on processor upgrade orders — confirm the correct Lenovo thermal kit for your chassis airflow zone.
• Assembled in Mexico: Country of origin MX, consistent with Lenovo's North American manufacturing footprint for ThinkSystem components.

Integration & Compatibility

The 4XG7B02708 is designed exclusively for the Lenovo ThinkSystem SR645 V3 platform. It is not a universal AMD EPYC 9004-series drop-in — Lenovo option parts carry platform-specific firmware validation, and installing in unsupported chassis voids support agreements. If you are building or expanding a rack server deployment, verify the current SR645 V3 Lenovo ThinkSystem compatibility matrix and BIOS version requirements before commissioning dual-socket configurations. For environments running virtualization stacks or software-defined storage across multiple nodes, pairing with appropriate network infrastructure and power delivery is essential given the 300W per-socket thermal load.

Frequently Asked Questions

Q: Does the Lenovo 4XG7B02708 include a heatsink or cooling fan?

A: No. The 4XG7B02708 is a processor-only kit — no fan or heatsink is included. You must order the appropriate Lenovo thermal kit for the SR645 V3 chassis separately before installation.

Q: What server platform is the 4XG7B02708 compatible with?

A: This processor is a Lenovo option part specifically validated for the ThinkSystem SR645 V3. It is not a generic AMD EPYC 9455 retail processor and should not be installed in non-Lenovo or unsupported Lenovo chassis.

Q: What is the core count and base clock speed of the 4XG7B02708?

A: The AMD EPYC 9455 in the 4XG7B02708 delivers 48 cores at a 3.15GHz base frequency with a 300W thermal design power.

Q: Is the 4XG7B02708 suitable for dual-socket SR645 V3 configurations?

A: The SR645 V3 supports dual-socket AMD EPYC configurations. However, verify BIOS version compatibility and matching processor stepping with your existing installed processor before ordering a second 4XG7B02708 for a dual-socket build.

Ted Perry

The 4XG7B02708 is a 48-core AMD EPYC 9455 at 3.15GHz with a 300W TDP — a processor profile that fits dense virtualization or parallel compute workloads on the SR645 V3, but one that demands careful pre-order planning because the fan is not in the box.

Technical Highlights:

• 48 Cores at 300W: Core density is the selling point here — workloads that distribute cleanly across threads (VM hosts, Kubernetes nodes, parallel batch) benefit directly; single-threaded latency-sensitive tasks are better served by a lower-core, higher-boost part.
• 3.15GHz Base Clock: Solid for a 48-core EPYC — the base frequency holds under full load, which matters for mixed workloads where some threads can't afford to clock-down while others are saturated.
• Platform-Locked Option Part: Lenovo validates option processors against specific SR645 V3 BIOS revisions — this is not a retail CPU. The upside is pre-validated stability; the constraint is that it must stay in its validated chassis.

Deployment Considerations:

• Order the thermal kit before the processor ships — the SR645 V3 requires a specific heatsink matched to the chassis airflow zone (standard vs. high-performance cooling). Arriving on-site without it halts the build.
• For dual-socket builds, processor stepping must match. If the first socket is already populated, confirm the installed processor's stepping before ordering the 4XG7B02708 as the second unit.

Best fit for ThinkSystem SR645 V3 deployments expanding compute density for virtualization or HPC workloads where core count directly translates to VM slot count or parallel job throughput.