Lenovo 4X67B10740 SR665 V3 IBM GPU THM KIT

Lenovo 4X67B10740 SR665 V3 GPU Thermal Kit

Overview

The Lenovo 4X67B10740 is a GPU thermal management kit designed for the ThinkSystem SR665 V3 server platform. When deploying GPU accelerators in the SR665 V3, proper thermal interface hardware is required to maintain safe operating temperatures under sustained compute workloads — this kit provides that purpose-built thermal hardware for IBM-compatible GPU configurations. The 4X67B10740 is a factory-new, genuine Lenovo accessory sourced direct from the manufacturer supply chain.

Compatibility

This kit is designed for the Lenovo ThinkSystem SR665 V3 server platform in GPU-accelerated configurations. It is specifically identified as an IBM GPU thermal kit, making it applicable to SR665 V3 deployments integrating GPU compute accelerators in data center and edge AI inference environments. Verify your specific GPU option kit against the Lenovo SR665 V3 compatibility matrix before ordering — thermal kits are GPU-model-specific and not universally interchangeable across accelerator families. Consult the server accessories category for companion components including riser cards and power option kits relevant to GPU builds.

Installation Notes

At 10.00 lb, this kit ships with the thermal hardware mass expected for enterprise server GPU installations — handle with standard ESD precautions. Installation must follow Lenovo SR665 V3 service documentation procedures; GPU thermal kits require proper torque sequencing on mounting hardware and correct thermal interface material application to avoid hot-spot formation under load. This is a field-installable CRU (Customer Replaceable Unit) class component — verify your service agreement coverage before installing in a warranty-active system. Manufactured in Mexico (MX) to Lenovo production standards.