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Overview

SKU: KSM64R52BS8-16MH
UPC: 740617360349
Condition: New
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Kingston KSM64R52BS8-16MH 16GB 6400MT/S DDR5 ECC REG CL52 DIMM 1RX8 Micron

Kingston KSM64R52BS8-16MH 16GB DDR5-6400 ECC Registered Server DIMMOverviewThe Kingston KSM64R52BS8-16MH is a 16GB DDR5 ECC Registered DIMM running at…

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Kingston KSM64R52BS8-16MH 16GB 6400MT/S DDR5 ECC REG CL52 DIMM 1RX8 Micron

$755.00
$499.99

Overview

SKU: KSM64R52BS8-16MH
UPC: 740617360349
Condition: New

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Description

Kingston KSM64R52BS8-16MH 16GB DDR5-6400 ECC Registered Server DIMM

Overview

The Kingston KSM64R52BS8-16MH is a 16GB DDR5 ECC Registered DIMM running at 6400MT/s — a single-rank, x8 module built for server and workstation platforms that demand both high bandwidth and memory integrity. Sourced factory-new with a Micron H-die, this module slots into DDR5 RDIMM-compatible motherboards and delivers On-Die ECC in addition to traditional ECC error correction, making it well-suited for compute-intensive workloads where silent data corruption is not an option.

If you are specifying memory for a rack server, edge compute node, or high-availability workstation and need to match a 6400MT/s platform requirement, the KSM64R52BS8-16MH (often searched as KSM64R52BS8 16MH) is worth evaluating before defaulting to a lower-speed SKU.

Key Features

  • DDR5-6400 at 6400MT/s: That transfer rate is roughly 25% faster than DDR5-5200 modules. On memory-bandwidth-sensitive workloads — database query buffers, in-memory analytics, video transcoding queues — the difference is measurable, not theoretical. Verify your platform's BIOS/QVL supports 6400MT/s before ordering; not every DDR5 board reaches this speed.
  • ECC + On-Die ECC (two layers): Standard ECC corrects single-bit errors at the DIMM-to-CPU interface. On-Die ECC (ODECC) is a second, independent correction layer running inside the DRAM chips themselves — it catches errors before they ever reach the bus. For 24/7 servers or AI inference nodes running uninterrupted, that dual correction is the reason to choose ECC DDR5 over consumer-grade memory.
  • Registered (Buffered) Architecture — 1Rx8: The registered buffer decouples the memory controller from the DRAM chips, enabling larger DIMM counts per channel without signal integrity collapse. The 1Rx8 layout (one rank, x8 data width) gives good density-per-slot while preserving compatibility on boards that restrict dual-rank loading at 6400MT/s.
  • CAS Latency 52 (CL52) at 1.1V: CL52 is standard for DDR5-6400 RDIMM operation. At 1.1V, the module stays within the DDR5 JEDEC voltage envelope — no overvoltage required, no custom BIOS profiles needed. Row cycle time is 48ns; row active time is 32ns; these are JEDEC-standard values for this speed grade, meaning out-of-the-box compatibility with any DDR5 RDIMM server platform that ships with JEDEC defaults enabled.
  • 16GB / 288-Pin DIMM Form Factor: The standard 288-pin DDR5 DIMM footprint installs directly into any DDR5 RDIMM slot. 16GB per module allows flexible population — run two for 32GB in dual-channel, four for 64GB, or scale to platform maximums. Smaller starting capacity also keeps initial build costs lower when full memory population is not needed on day one.
  • 1.1V Operating Voltage: Lower than DDR4's 1.2V baseline. Across a dense server rack with dozens of DIMMs per system, the aggregate power savings are real. If your platform is spec'd for power efficiency (edge deployments, thermally constrained enclosures), this matters more than it looks on paper.
  • Operating Temperature 0–95°C: The full 0–95°C operating range covers both standard data center environments and warmer edge/industrial enclosures where ambient temperatures can climb. Storage range extends to -55–100°C, so shipping and warehouse staging in extreme climates will not damage the module before it ever goes into service.
  • RoHS Compliant: RoHS compliance is a procurement requirement for many government, education, and enterprise buyers. The KSM64R52BS8-16MH clears that gate without needing an exemption waiver.
  • Micron H-Die: The module uses Micron H-die DRAM, which matters when you are matching a platform's QVL (Qualified Vendor List) by die vendor. Some server OEM QVLs distinguish between die manufacturers — specifying Micron H here lets your validation team confirm compatibility against published QVL entries before installation.

Integration and Compatibility

This module is designed for DDR5 RDIMM platforms — confirm your motherboard or server platform explicitly supports DDR5 Registered (buffered) DIMMs at 6400MT/s. Unbuffered (UDIMM) slots will not accept this module. Check the server OEM's QVL for KSM64R52BS8-16MH to verify supported slot populations and channel configurations before finalizing your memory BOM. Mixed-speed DIMM populations will downclock the entire channel to the slowest installed module — for best results, populate all slots in a channel with matching speed-grade RDIMMs.

For server memory deployments in networking and server environments, DDR5-6400 RDIMM platforms typically include current-generation Intel Xeon Scalable and AMD EPYC processors — verify socket and chipset support before specifying. Pairing with an appropriate server component ecosystem ensures full speed-grade validation. If your platform targets DDR5 but only qualifies at 4800 or 5600MT/s, a lower-speed RDIMM from the same Kingston Server Premier family may be the right fit — do not over-specify speed grade just to leave headroom.

Frequently Asked Questions

Q: Is this module a buffered or unbuffered DIMM?

A: The KSM64R52BS8-16MH is a Registered (Buffered) DIMM — RDIMM. It requires a motherboard or server platform with DDR5 RDIMM-compatible slots. It will not function in UDIMM or LRDIMM-only slots.

Q: What does On-Die ECC mean for server reliability?

A: On-Die ECC is an error correction layer built into the DRAM chips themselves, operating independently of the system-level ECC that runs between the DIMM and the CPU. The result is two independent error-correction passes — ODECC catches intra-chip errors before they reach the bus, while traditional ECC handles errors at the channel level. This dual-layer approach reduces uncorrectable error rates, which matters for databases and AI workloads running continuously.

Q: What is the operating voltage of the KSM64R52BS8-16MH?

A: The module operates at 1.1V, which is within the JEDEC DDR5 standard voltage specification. No BIOS voltage overrides are required for standard operation.

Q: What CAS latency does this module use?

A: CAS latency is CL52 — the JEDEC-standard latency for DDR5-6400 RDIMMs. Row cycle time is 48ns and row active time is 32ns, also JEDEC-standard for this speed grade.

Q: Is this module RoHS compliant?

A: Yes. The KSM64R52BS8-16MH carries RoHS compliance certification, meeting the requirements for government, education, and enterprise procurement programs that mandate RoHS-compliant components.

Q: Why does the die vendor (Micron H) matter when specifying this module?

A: Server OEM QVLs (Qualified Vendor Lists) frequently list memory modules by both part number and DRAM die manufacturer. Some platforms distinguish between Micron, Samsung, and SK Hynix dies when granting qualification. Knowing this module uses Micron H-die lets you cross-reference your platform's QVL at that level of detail, reducing the chance of a compatibility surprise during system validation.

James Everett
James Everett

When I spec memory for a new server build, the first question I ask is whether the platform QVL distinguishes die vendors — and for DDR5-6400, it often does. The KSM64R52BS8-16MH specifies Micron H-die explicitly, which saves a validation cycle when you're working against a strict OEM QVL. The 6400MT/s transfer rate and CL52 timing are both JEDEC-standard for this speed grade at 1.1V, so there's nothing exotic here that would trip up a standard DDR5 RDIMM platform.

Technical Highlights:

  • Dual-layer error correction (ECC + ODECC): On-Die ECC corrects errors inside the DRAM chips at the die level; traditional ECC handles the DIMM-to-CPU channel. Running both simultaneously lowers the uncorrectable error rate — relevant for any workload that runs 24/7 without scheduled reboots.
  • 6400MT/s at 1.1V: Higher bandwidth than DDR5-5200 or DDR5-4800 alternatives, at the JEDEC-standard voltage. No BIOS overrides needed — the module runs at spec straight out of the slot.
  • 0–95°C operating range: Covers standard data center ambient up through edge enclosures where cooling may be passive or intermittent. Storage temperature tolerance of -55–100°C means this module survives staging environments that would stress lesser components.

Deployment Considerations:

  • Confirm your server platform's BIOS revision supports DDR5-6400 before ordering — many boards shipped with DDR5-5200 as the validated ceiling and require a firmware update to reach 6400MT/s. A wrong BIOS revision means the DIMM will train at a lower speed grade, and you won't see the performance you paid for.
  • This is a 1Rx8 single-rank module. Some platforms restrict high-speed operation to single-rank DIMMs per channel; mixing 1Rx8 with 2Rx8 (dual-rank) modules in the same channel will force the channel to the lower speed grade of the two. Keep rank configurations consistent within a channel.

This module is the right fit for current-generation Intel Xeon or AMD EPYC rack servers where the platform QVL calls out DDR5-6400 RDIMM at 16GB with Micron H-die — a precise match that removes the ambiguity from your memory BOM before the system goes into production.

Specifications
On-Die ECC: Yes
CAS latency: 52
Internal memory: 16 GB
Memory layout (modules x size: 1 x 16 GB
Internal memory type: DDR5
Memory data transfer rate: 6400 MT/s
Component for: PC
Memory form factor: 288-pin DIMM
ECC: Yes
Buffered memory type: Registered (buffered)
Memory voltage: 1.1 V
Row cycle time: 48 ns
Refresh row cycle time: 295 ns
Row active time: 32 ns
Row Precharge Time (TRP: 16
Operating temperature (T-T: 0 - 95 °C
Storage temperature (T-T: -55 - 100 °C
Compliance certificates: RoHS
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