Tyan B8030F65TV8E2H-N Dual-Socket AMD EPYC 7003 Server Motherboard

Overview

The Tyan B8030F65TV8E2H-N is a dual-socket server motherboard built for AMD EPYC 7003 Series (3rd Gen) processors — the platform layer under recording servers, VMS hosts, and compute nodes that need to chew through multi-camera analytics or dense virtualization loads. At 34.84 x 17.24 x 1.71 in and 70 lb as shipped, this is an enterprise-class extended form-factor board, not a desktop part — plan your chassis and rack space accordingly before you order. Manufactured in China (CN) under Tyan's commercial-grade production line, the B8030F65TV8E2H-N (often searched as B8030F65TV8E2H N) targets system builders and integrators assembling custom recording servers, edge compute nodes, or virtualization hosts around 3rd Gen EPYC silicon.

Key Features

• Dual AMD EPYC 7003 Series sockets: Two 3rd Gen EPYC processors on one board means you're scaling core count and memory bandwidth on a single chassis instead of clustering multiple boxes — fewer nodes to rack, cable, and patch for the same aggregate compute.
• 70 lb board weight: That mass reflects a fully-built server-class PCB with extensive VRM stages and multiple expansion headers — budget for a reinforced rack shelf or chassis tray rather than a standard slide rail rated for lighter boards.
• 34.84 x 17.24 in footprint: This is an extended-ATX-class server board — confirm chassis bay width and standoff layout before ordering, since a footprint this size won't drop into a standard mid-tower.
• 1.71 in board thickness: Reflects layered PCB construction typical of dual-socket designs with heavy trace routing between sockets, memory channels, and expansion slots — a factor when clearing chassis standoffs and adjacent card slots.
• UNSPSC 43211502 (motherboards) classification: Confirms this SKU is cataloged as a bare server motherboard for procurement and inventory systems that filter by UNSPSC — useful when matching against a BOM or RFQ line item.

Integration & Compatibility

Because this board is built around the AMD EPYC 7003 Series socket platform, pair it with compatible 3rd Gen EPYC processors, registered ECC memory, and a chassis sized for its 34.84 x 17.24 in dimensions. If you're speccing a full recording or analytics server rather than a bare board, check the network video recorders category for pre-built alternatives, or review a VMS architecture guide before committing to a custom build — a dual-socket EPYC platform is generally overkill unless you're running heavy analytics workloads or high camera-count VMS instances. For power infrastructure sized to a board this dense, pair it with rack-mount power supplies rated for dual-socket server loads, and browse the full Tyan server board catalog for compatible chassis and expansion options. If you need networking throughput to match a heavy compute buildout, review PoE and network switches for the recording infrastructure this board will ultimately feed.

What's in the Box

Ships as a bare motherboard. Processors, memory, chassis, and cabling are sourced separately based on your build configuration.

Frequently Asked Questions

Q: What processors does the B8030F65TV8E2H-N support?

A: The board is built for dual AMD EPYC 7003 Series (3rd Gen) processors in a two-socket configuration.

Q: How much does the B8030F65TV8E2H-N weigh?

A: The board ships at 70 lb, reflecting a full server-class extended form-factor design — plan chassis and shipping handling accordingly.

Q: What are the dimensions of the B8030F65TV8E2H-N?

A: 34.84 x 17.24 x 1.71 in (L x W x H) — confirm your chassis bay clears this footprint before ordering.

Q: Where is the B8030F65TV8E2H-N manufactured?

A: Country of origin is China (CN), per manufacturer data.

Q: Does the B8030F65TV8E2H-N include a processor or memory?

A: No — it ships as a bare motherboard. CPUs, RAM, and chassis are sourced separately.

Eden Phillips

The B8030F65TV8E2H-N is a dual-socket board, and that's the whole story here — two AMD EPYC 7003 Series sockets on one PCB tells you this is meant for consolidation, not entry-level builds. If you're spinning up a recording server that needs to handle a lot of concurrent decode/analytics threads, this is the class of board that gets you there without going to a two-node cluster.

Technical Highlights:

• Dual EPYC 7003 sockets: Consolidates compute that would otherwise need two separate 1P chassis into a single 34.84 x 17.24 in board — fewer power supplies, fewer network drops, one BMC to manage.
• 70 lb shipped weight: A good proxy for build density — this isn't a lightly-populated board, it's carrying substantial VRM and expansion hardware to feed two EPYC sockets simultaneously.
• 1.71 in board thickness: Tells you there's real layer count in this PCB for routing dual-socket memory and PCIe lanes cleanly — expect tight clearance requirements against chassis standoffs.

Deployment Considerations:

• At 34.84 x 17.24 in, this board needs a purpose-built extended-ATX or proprietary server chassis — don't assume it drops into a generic 4U case without checking standoff and bay width first.
• The 70 lb weight is board-only — factor in substantial additional weight once CPUs, heatsinks, memory, and a chassis are added for rack capacity planning.

This board makes sense when you're building a dedicated analytics or VMS compute node that needs dual-socket EPYC horsepower — think a centralized recording server handling deep-learning analytics across dozens of camera streams, where a single-socket board would bottleneck under concurrent workloads.