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Tyan S8030GM2NE AMD EPYC 7003 Series Server Motherboard
The Tyan S8030GM2NE is a server-class motherboard built for AMD EPYC 7003 Series (3rd Gen) processor platforms. Confirmed physical specifications include a board footprint of 14.00 x 10.50 x 3.00 in and a shipping weight of 5.00 lb, with country of origin listed as China (CN). This model is intended for integrators and IT architects speccing EPYC 7003-based server builds who need a compact-footprint board for a rack or custom chassis deployment.
Overview
The S8030GM2NE from Tyan's server motherboard catalog targets deployments standardized on AMD's EPYC 7003 Series processor family. Beyond the platform generation and physical dimensions listed above, manufacturer specification data for this specific SKU (socket configuration, chipset, memory channels, expansion slots, onboard networking, and I/O) is not available in the current evidence set. Rather than guess at chipset or slot counts — which vary across the S8030 board family — this listing covers only what is verified for the S8030GM2NE, and it should be confirmed against the current manufacturer datasheet before final system design.
Key Features
- AMD EPYC 7003 Series platform support: built for 3rd Gen EPYC processors, which is relevant when standardizing a server refresh or new build around that CPU generation rather than mixing platform generations in the same rack.
- 14.00 x 10.50 x 3.00 in footprint: a fixed board envelope to check against your target chassis or network video recorder enclosure before ordering, since server motherboard form factors are not universally interchangeable.
- 5.00 lb shipping weight: useful for freight and rack-loading calculations when provisioning multiple units for a multi-node deployment.
- China (CN) country of origin: relevant for procurement teams tracking supply chain origin on federal, state, or municipal bids with country-of-origin disclosure requirements.
Integration & Compatibility
Because detailed I/O, chipset, and memory specifications for the S8030GM2NE are not confirmed in current evidence, integrators should cross-check compatible EPYC 7003 processor SKUs, DIMM types, and expansion slot layout directly against the manufacturer's published documentation for this exact part number before finalizing a bill of materials. If you're building out a broader server or recording infrastructure around this board, review a storage and retention planning guide to size drive and memory requirements correctly for the workload, and pair the finished build with an appropriate PoE switch or network uplink depending on deployment role.
Frequently Asked Questions
Q: What processor family does the Tyan S8030GM2NE support?
A: The S8030GM2NE is built for AMD EPYC 7003 Series (3rd Gen) processors.
Q: What are the physical dimensions of the S8030GM2NE?
A: The board measures 14.00 x 10.50 x 3.00 in (L x W x H) and weighs 5.00 lb.
Q: Where is the S8030GM2NE manufactured?
A: Country of origin is listed as China (CN).
Q: Is detailed chipset and memory support information available for this board?
A: Full chipset, memory, and expansion slot specifications for this exact SKU are not confirmed in current listing data — check the manufacturer's datasheet for the S8030GM2NE before finalizing a build.

The S8030GM2NE is one of Tyan's boards positioned for AMD EPYC 7003 Series deployments, and the two numbers I'd actually plan a build around here are the 14.00 x 10.50 x 3.00 in footprint and the 5.00 lb shipping weight — everything else on this listing needs to be verified against the manufacturer datasheet before you commit a BOM.
Technical Highlights:
- AMD EPYC 7003 Series support: confirms 3rd Gen EPYC platform compatibility, which matters if you're standardizing a rack on a single CPU generation to keep spare-parts and BIOS management consistent.
- 14.00 x 10.50 x 3.00 in board envelope: check this against your chassis cutout and standoff pattern before ordering — a mismatch here is a return, not a fix.
- 5.00 lb per-unit weight: factor this into freight quotes and rack weight budgets if you're deploying more than a handful of nodes at once.
Deployment Considerations:
- I don't have confirmed chipset, DIMM slot count, or onboard NIC specs for this exact SKU in front of me — pull the current Tyan datasheet for S8030GM2NE specifically before finalizing memory or NIC procurement, since board variants in this family differ.
- Country of origin is listed as CN — flag this early if you're bidding on a contract with country-of-origin sourcing restrictions.
Reasonable fit for an integrator already committed to an AMD EPYC 7003 platform who has the full manufacturer spec sheet in hand and just needs to confirm chassis fit and freight weight for the S8030GM2NE before ordering — not a board I'd spec blind without that datasheet.
Compare with similar
Tyan S8030GM2NE AMD EPYC 7003 SERIES - 3RD GEN
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