Tyan B8030F65TV8E2H-2T-N AMD EPYC 7003 Series Server Motherboard

Overview

The B8030F65TV8E2H-2T-N is a server-class motherboard from Tyan built around AMD's EPYC 7003 series ('Milan') processor platform. At 34.84 x 17.24 in, the board uses an extended server form factor sized for rackmount and tower chassis designed around Tyan's B8030 platform family — confirm chassis compatibility against these exact dimensions before ordering. The board ships at 70 lb as packaged, which includes protective packaging and accessories weight beyond the bare PCB. Country of origin is China (CN), relevant for organizations tracking supply-chain and NDAA/customs documentation on server infrastructure purchases.

Key Features

• AMD EPYC 7003 Series platform support: targets 3rd Gen EPYC ('Milan') processors, the generation AMD positioned for dense multi-core server and virtualization workloads.
• Extended server form factor (34.84 x 17.24 in): a large-format board — measure your chassis tray and standoff layout against these exact dimensions before purchasing, since a mismatch here means a non-starter install.
• 70 lb shipping weight: plan freight and receiving logistics accordingly — this is a heavier, palletized-class shipment rather than a small-parcel board.
• Country of origin CN: factor this into any customs, import-compliance, or country-of-origin documentation your procurement process requires for the B8030F65TV8E2H-2T-N.

Because manufacturer-published specification data (chipset, DIMM slot count and memory type, PCIe expansion lanes, onboard networking, BMC/IPMI management, and power input requirements) is not available in current evidence for the B8030F65TV8E2H-2T-N (often searched as B8030F65TV8E2H 2T N), those details are intentionally omitted here rather than guessed. Cross-reference the full Tyan datasheet for this exact model before finalizing a build-out, particularly for socket count, memory topology, and expansion slot layout, since EPYC 7003 boards in this size class vary significantly between single- and dual-socket configurations.

Frequently Asked Questions

Q: What processor family does the B8030F65TV8E2H-2T-N support?

A: It is built for AMD's EPYC 7003 series (3rd Gen EPYC, 'Milan') platform.

Q: How big is the B8030F65TV8E2H-2T-N and what chassis fits it?

A: The board measures 34.84 x 17.24 x 1.71 in — verify this against your specific chassis tray dimensions and standoff pattern before ordering, since exact chipset and form-factor class details beyond these dimensions are not confirmed here.

Q: Where is the B8030F65TV8E2H-2T-N manufactured?

A: Country of origin is listed as China (CN).

Q: How much does the B8030F65TV8E2H-2T-N weigh for shipping purposes?

A: 70 lb as packaged and shipped.

Eden Phillips

What stands out first on the B8030F65TV8E2H-2T-N is sheer footprint — 34.84 x 17.24 in puts this solidly in extended server-board territory, built around AMD's EPYC 7003 platform.

Technical Highlights:

• EPYC 7003 series platform: targets 3rd Gen EPYC silicon, the generation AMD built for core-dense virtualization and consolidation workloads.
• 34.84 x 17.24 x 1.71 in board dimensions: this is a large-format board — check standoff layout and tray clearance in your chassis before committing, since a size mismatch is the single most common integration failure on boards this size.
• 70 lb shipping weight: plan for freight-class handling on receiving rather than treating this like a small-parcel component delivery.

Deployment Considerations:

• Confirm chipset, DIMM topology, and PCIe lane layout against Tyan's full published datasheet for this exact model before finalizing a build — those details aren't in the current spec sheet on file and vary across boards in this size class.
• Country of origin is CN — factor that into any procurement or import-compliance documentation your organization requires for server infrastructure purchases.

Right fit for a build-out where the chassis and rack layout are already planned around this exact Tyan B8030-family footprint and an EPYC 7003 socket strategy — confirm remaining platform specifics directly against Tyan's datasheet before finalizing the order.