Lenovo 4XG7A63655 SR650 V2 Platinum 8352M 32C 185W 2.3GHZ

Lenovo 4XG7A63655 Intel Xeon Platinum 8352M 32-Core Processor Option for ThinkSystem SR650 V2

Overview

The Lenovo 4XG7A63655 is a factory-configured processor option kit delivering the 3rd Generation Intel® Xeon® Platinum 8352M to Lenovo ThinkSystem SR650 V2 platforms. At 32 cores, 64 threads, and a 2.3 GHz base clock with 3.5 GHz Turbo Boost, this processor targets memory-bandwidth-sensitive workloads — database engines, in-memory analytics, ERP back ends, and virtualization hosts running high-VM-density environments where per-core licensing makes raw core count matter. If you're configuring or expanding an SR650 V2 and need a high-core-count Platinum-tier processor without stepping outside the Lenovo server processor supply chain, the 4XG7A63655 is the field-installable path to get there.

Key Features

• 32 Cores / 64 Threads (Ice Lake, 10 nm): Thirty-two physical cores on Intel's Ice Lake microarchitecture means meaningful per-core performance gains over prior Cascade Lake generations — better IPC translates directly to fewer VMs starved for CPU cycles in dense VMware or Hyper-V environments. The 64-thread count also matters for workloads that scale with logical CPU count, such as Java application servers and parallel ETL jobs.
• 2.3 GHz Base / 3.5 GHz Turbo Boost: The 2.3 GHz base is designed for sustained all-core throughput under continuous load. The 3.5 GHz single-core Turbo ceiling handles latency-sensitive bursts — useful in OLTP databases where a single hot thread needs headroom. The 1.2 GHz spread between base and boost gives workload schedulers meaningful dynamic range.
• 48 MB L3 Cache: The 48 MB last-level cache reduces main-memory round trips on working sets that fit within cache — in-memory database queries, analytics aggregations, and frequent hot-data access patterns all benefit. Larger cache is directly meaningful when per-core memory bandwidth is a bottleneck.
• 185 W TDP: At 185 W, this processor sits in the mid-tier of the Xeon Platinum power envelope. Confirm your SR650 V2 power supply configuration supports dual-processor TDP before installation — a 185 W processor in a two-socket build draws 370 W at processor TDP alone, and that budget needs to factor into total rack power planning for the enclosure.
• LGA 4189 Socket / Ice Lake Platform: The LGA 4189 (Socket P+) interface is native to the SR650 V2 platform. This is not a cross-platform part — it installs only in servers built on Intel's Ice Lake-SP architecture. Verify your SR650 V2 base model's supported processor list in Lenovo's ServerProven database before ordering if your chassis predates the V2 refresh.
• 11.2 GT/s System Bus / PCIe 4.0 Uplift: Ice Lake's 11.2 GT/s UPI bus rate is a step up from prior-gen platforms and feeds PCIe 4.0 lanes directly from the processor — doubling available bandwidth to NVMe storage and high-speed NICs compared to PCIe 3.0. If your SR650 V2 is running Gen 4 NVMe drives or 100GbE adapters, this CPU's native PCIe 4.0 support removes the bandwidth ceiling those devices could otherwise hit.
• 64-Bit / 10 nm Lithography: The 10 nm process node underpins Ice Lake's efficiency improvements over the 14 nm Cascade Lake generation — better instructions-per-watt at the same clock means more throughput within the same 185 W TDP budget, not just raw clock speed.

Integration and Compatibility

The 4XG7A63655 is a Lenovo-qualified processor option designed specifically for the ThinkSystem SR650 V2 two-socket rack server. It installs in the LGA 4189 (Socket P+) socket on SR650 V2 system boards. Installation requires a compatible heatsink — a processor heatsink kit is sold separately and is not included with this option. Lenovo's server memory configuration must also be validated post-installation, as Ice Lake platforms support up to 6-channel DDR4 per processor and DIMM population rules affect maximum achievable bandwidth. For environments integrating with network infrastructure or high-speed storage fabrics, confirm that the SR650 V2 system board BIOS is at a firmware level that supports the 8352M before installation — Lenovo publishes minimum firmware levels for each processor option in its FixCentral repository. This processor is suited for deployment in datacenter server configurations where workload density, memory bandwidth, and PCIe 4.0 I/O throughput are design priorities.

Frequently Asked Questions

Q: Which server platforms support the Lenovo 4XG7A63655 processor?

A: The 4XG7A63655 is qualified for the Lenovo ThinkSystem SR650 V2. It uses the LGA 4189 (Socket P+) interface, which is specific to Intel Ice Lake-SP generation servers. Always verify compatibility against Lenovo's ServerProven database for your specific chassis and system board before ordering.

Q: Does the 4XG7A63655 include a heatsink or cooler?

A: No. The processor option does not include a heatsink or thermal solution. A compatible heatsink kit must be ordered separately. Lenovo offers heatsink options rated for standard and high-performance thermal scenarios — select based on your chassis airflow and thermal design.

Q: What is the Turbo Boost frequency of the Xeon Platinum 8352M?

A: The Intel Xeon Platinum 8352M in the 4XG7A63655 boosts to 3.5 GHz on a single core under Turbo conditions, from a 2.3 GHz base clock across all 32 cores.

Q: How many PCIe lanes does the Xeon Platinum 8352M provide, and what generation?

A: The 8352M is an Ice Lake-SP processor supporting PCIe 4.0 natively via the LGA 4189 platform. PCIe 4.0 doubles available per-lane bandwidth compared to PCIe 3.0, which directly benefits Gen 4 NVMe drives and 100GbE adapters installed in the SR650 V2.

Q: What is the TDP of the 4XG7A63655, and how does that affect power planning?

A: The Xeon Platinum 8352M has a 185 W TDP. In a two-socket SR650 V2 configuration, both processors at full TDP consume 370 W at the processor level alone. Confirm your power supply configuration and PDU capacity account for total system draw including memory, storage, and expansion cards.

Q: Is the 8352M processor an Intel Xeon Scalable processor?

A: Yes. The 8352M is a 3rd Generation Intel Xeon Scalable processor from the Platinum 8000 series, manufactured on Intel's 10 nm process (Ice Lake-SP, processor codename Ice Lake), with 32 cores, 64 threads, and 48 MB L3 cache.

Ted Perry

The 4XG7A63655 is a deliberate processor selection for SR650 V2 builds where you need 32 physical cores at Platinum-tier IPC without climbing to the top of the Xeon stack on power draw. The 185 W TDP keeps this part manageable in a two-socket configuration — you're not at the 205–270 W ceiling of the higher-bin Platinum parts, which simplifies PSU sizing while still giving you full Ice Lake memory channel support and native PCIe 4.0.

Technical Highlights:

• 32C/64T at 10 nm Ice Lake: The move from 14 nm Cascade Lake to 10 nm Ice Lake isn't just a die-shrink story — IPC improvements of roughly 18–20% generation-over-generation mean these 32 cores deliver meaningfully more throughput per clock than equivalent Cascade Lake core counts, without a frequency increase.
• 3.5 GHz Single-Core Turbo: The 1.2 GHz spread between the 2.3 GHz base and 3.5 GHz Turbo gives the scheduler real headroom for bursty single-threaded workloads — relevant in OLTP, Java middleware, and any application that serializes critical-path operations through a single thread.
• 48 MB L3 Cache: At 1.5 MB of L3 per core, this part is well-provisioned for in-memory database and analytics workloads where keeping working sets in cache avoids main-memory latency penalties — especially relevant at 6-channel DDR4 where cache misses are relatively more expensive than on bandwidth-constrained platforms.

Deployment Considerations:

• No heatsink is included — budget for a separate Lenovo heatsink kit compatible with the SR650 V2 form factor and your chassis airflow configuration. Do not reuse heatsinks from Cascade Lake builds without verifying mechanical and thermal compatibility with the LGA 4189 socket.
• At 185 W per socket, two-socket builds hit 370 W at processor TDP alone. Validate your SR650 V2 PSU configuration (Lenovo offers 750 W, 1100 W, and 1800 W options) handles full-load draw including DIMM population, NVMe drives, and PCIe add-in cards before the system goes to production.

This processor is the right fit for SR650 V2 deployments running high-density VMware vSphere or Red Hat OpenShift clusters where per-core software licensing makes 32 physical cores a meaningful cost lever — fewer sockets, more cores per socket, lower licensing exposure than spreading the same workload across more two-socket nodes.