Lenovo 4XG7A63654 SR630 V2 Platinum 8352M 32C 185W 2.3GHZ

Lenovo 4XG7A63654 Intel Xeon Platinum 8352M 32-Core Processor Option for ThinkSystem SR630 V2

Overview

The Lenovo 4XG7A63654 is the factory processor option that installs the Intel Xeon Platinum 8352M into a ThinkSystem SR630 V2 server — a 32-core, 64-thread Ice Lake processor running at 2.3 GHz base with a 3.5 GHz boost ceiling. If you're sizing an SR630 V2 for compute-intensive workloads like enterprise server deployments, virtual machine consolidation, or demanding analytics platforms, the 8352M is the entry point into Intel's Platinum 8000 tier within this chassis — meaning you get full memory bandwidth, AVX-512 instruction support, and the deep cache hierarchy that differentiates Platinum-class Xeon from Gold or Silver tiers.

Sourced through channel-direct distribution with no grey-market, no parallel imports — factory-new, genuine Lenovo option kit on a Lenovo server platform.

Key Features

• 32 Cores / 64 Threads (Ice Lake, 10nm): The 8352M's 32 physical cores handle 64 concurrent threads, which translates to meaningful parallelism for multi-tenant virtualization, containerized workloads, or video analytics engines running simultaneous inference streams. Intel's 10nm Ice Lake process also brings per-core efficiency gains over prior-generation Cascade Lake nodes.
• 2.3 GHz Base / 3.5 GHz Boost: At 2.3 GHz base, the 8352M is tuned for sustained throughput rather than single-threaded peak. The 3.5 GHz Turbo Boost ceiling handles bursts — useful for latency-sensitive tasks like database query spikes or on-demand transcoding — without requiring every core to sustain that frequency.
• 48 MB L3 Cache: 48 MB of shared last-level cache is substantial for this class. In practice it means frequently accessed data structures — VMS frame buffers, ML model weights for edge inference, database working sets — stay on-die longer, cutting memory controller round trips and reducing latency under mixed workloads.
• 185W TDP: The 185W thermal envelope is a planning number for your cooling and power budget per socket. If you're populating both sockets in the SR630 V2, account for up to 370W of processor TDP alone before adding DIMMs, NVMe, and I/O. Note that a cooler is not included with this processor option kit — confirm the appropriate heatsink is already installed or ordered separately for your chassis configuration.
• LGA 4189 Socket / 3rd Gen Xeon Scalable: The LGA 4189 socket is the standard mount for 3rd Generation Intel Xeon Scalable processors, and the 8352M slots into that ecosystem with full support for PCIe 4.0, Intel Optane Persistent Memory 200 series, and up to 8-channel DDR4 memory per socket. This matters when you need to expand memory capacity beyond what Gold-tier processors support.
• 11.2 GT/s System Bus: The UPI (Ultra Path Interconnect) bus running at 11.2 GT/s handles socket-to-socket communication in dual-socket configurations. For workloads that share data across both CPUs — distributed analytics, in-memory databases — a higher interconnect rate reduces the latency penalty of cross-socket memory access.
• AVX-512 and 64-bit Operating Modes: Full AVX-512 support enables hardware-accelerated vector math, which is the foundation for AI inference acceleration, image processing pipelines, and scientific computation. Any NVR or analytics server running deep learning-based video analytics benefits from this instruction set without requiring a discrete GPU for lighter inference loads.

Integration and Compatibility

The 4XG7A63654 is a Lenovo factory option kit specifically validated for the ThinkSystem SR630 V2 platform. As a 3rd Generation Intel Xeon Scalable processor on the LGA 4189 socket, it is not interchangeable with SR630 V1 (which used LGA 3647 / 2nd Gen Xeon Scalable). Before ordering, confirm your SR630 V2 chassis configuration and existing processor population — dual-socket deployments require matched processor pairs. Lenovo's system compatibility matrix for the SR630 V2 should be consulted for supported DIMM configurations when pairing this processor with specific memory modules. For integrators building out rack server infrastructure or expanding an existing SR630 V2 node, this option kit follows Lenovo's standard field upgrade process with Lenovo XClarity provisioning support.

Frequently Asked Questions

Q: What server platform is the Lenovo 4XG7A63654 compatible with?

A: The 4XG7A63654 is a processor option kit validated for the Lenovo ThinkSystem SR630 V2. It uses the LGA 4189 socket and is not compatible with the SR630 V1, which uses the older LGA 3647 socket.

Q: Does the 4XG7A63654 include a heatsink or cooler?

A: No. The cooler is not included with this processor option kit. Verify that the appropriate heatsink for your SR630 V2 chassis configuration is already installed or ordered separately before deployment.

Q: What is the base and boost clock speed of the Intel Xeon Platinum 8352M?

A: The 8352M runs at 2.3 GHz base frequency with a Turbo Boost ceiling of 3.5 GHz across its 32 cores and 64 threads.

Q: Can the SR630 V2 be configured with two of these processors?

A: The SR630 V2 is a dual-socket platform. If populating both sockets, processors must be matched pairs. Plan for up to 370W of combined processor TDP (2x 185W) when sizing your power and cooling infrastructure.

Q: What generation is the Intel Xeon Platinum 8352M?

A: The 8352M is a 3rd Generation Intel Xeon Scalable processor built on Intel's 10nm Ice Lake architecture, part of the Platinum 8000 series.

Q: Does the Xeon Platinum 8352M support AVX-512?

A: Yes. As a Platinum-tier 3rd Gen Xeon Scalable processor, the 8352M includes full AVX-512 support, enabling hardware-accelerated vector workloads including AI inference, image processing pipelines, and scientific computing.

Marty Allison

The 4XG7A63654 installs Lenovo's Intel Xeon Platinum 8352M into the SR630 V2 — and the spec that defines its deployment envelope is the 185W TDP combined with 32 cores at a 2.3 GHz sustained base. That ratio tells you this is a throughput processor, not a single-threaded frequency chaser. If your workload is heavily threaded — think multi-stream video analytics, VM density maximization, or parallel database query processing — the 8352M's 64-thread capacity and 48 MB L3 cache are doing real work. If you're running a lightly threaded application and considering this to add headroom, a Gold-tier processor with higher base frequency may be a better fit.

Technical Highlights:

• 32 Cores / 64 Threads at 10nm Ice Lake: Intel's 10nm node improves per-core IPC over Cascade Lake predecessors, meaning the 8352M delivers more compute per clock at the same TDP — relevant when you're constrained by rack power density rather than socket count.
• 3.5 GHz Turbo Boost: The 1.2 GHz headroom between base (2.3 GHz) and boost (3.5 GHz) gives the processor meaningful burst capacity for latency-sensitive operations without permanently running at the thermal ceiling — important in mixed workload environments where some threads need fast response while others run sustained batch jobs.
• 11.2 GT/s UPI Interconnect: In a dual-socket SR630 V2, this interconnect speed determines how efficiently the two CPUs share data. For analytics or in-memory workloads that cannot be cleanly partitioned to a single socket, 11.2 GT/s reduces the cross-NUMA penalty that can otherwise serialize throughput.

Deployment Considerations:

• No cooler is included — this is a common oversight on processor option kit orders. Verify your SR630 V2 already has the correct heatsink installed for the 185W TDP class before the kit arrives on-site.
• LGA 4189 is SR630 V2-specific. This processor does not drop into SR630 V1 chassis — confirm your chassis generation before procurement, especially in mixed-generation data center environments.

Best fit for SR630 V2 deployments running virtualized security analytics platforms, multi-tenant compute nodes, or video intelligence workloads where thread count and cache depth matter more than peak single-core clock speed.