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Tyan B8036G68V4E4HR-LE AMD EPYC 7003 Server Motherboard
Overview
The Tyan B8036G68V4E4HR-LE is a server-class motherboard built around AMD's EPYC 7003 Series (3rd Gen) processor platform, sized for high-density rackmount and tower server chassis. At 26.77 x 17.26 x 1.69 in and 23.50 lb, this is a full-size server board intended for integrators building or refreshing compute nodes for video management systems, recording infrastructure, and general enterprise workloads that need EPYC-class core counts and memory bandwidth. If you're speccing a new NVR backend, a VMS server cluster, or a general-purpose compute node and need a board that matches AMD's current-generation EPYC socket, the B8036G68V4E4HR-LE is a straightforward fit to evaluate against your chassis and power budget.
Key Features
- AMD EPYC 7003 Series (3rd Gen) platform support: gives you access to AMD's higher core-count server CPUs — relevant if you're consolidating multiple recording or virtualization workloads onto fewer physical nodes instead of scaling out with more boxes.
- Full server-board footprint (26.77 x 17.26 in): confirm chassis compatibility before ordering — a board this size needs a server or workstation-class enclosure with matching standoff layout, not a compact desktop case.
- 1.69 in board depth/height clearance: factor this into chassis and airflow planning, particularly in 2U or 4U rack enclosures where component clearance above the board is tight.
- 23.50 lb shipping weight: reflects a fully-featured server board with substantial VRM and I/O componentry — plan freight and handling accordingly, especially for multi-unit orders.
- Manufactured in China (country of origin CN): relevant for buyers tracking supply chain origin on procurement paperwork or government-adjacent purchasing requirements.
- UNSPSC 43211502 classification: this code identifies the board as a computer/server motherboard for procurement systems that filter by UNSPSC — useful when submitting this SKU into government or enterprise purchasing catalogs.
Integration & Compatibility
Because the B8036G68V4E4HR-LE is built for the EPYC 7003 Series socket, it pairs with 3rd Gen EPYC CPUs rather than earlier or later EPYC generations — confirm your target processor part number falls within the 7003 family before purchasing. For deployments feeding a network video recorder stack or a VMS cluster, this board is a backend compute component, not a finished appliance — you'll need to pair it with compatible EPYC CPUs, ECC memory, and a chassis rated for its dimensions and weight. If you're planning storage-heavy recording infrastructure around this board, review a storage and retention planning guide to size drive bays and RAID configuration against your camera count and retention window before finalizing the chassis. Pair the finished server with PoE network switches if it's feeding a camera deployment directly, and browse the broader Tyan server board catalog if you need a different socket generation, form factor, or I/O configuration for a different node in the same rack. For buyers standardizing on a single server platform across a facility, review the server hardware category to compare this board against other chassis-ready options before committing to a rack layout.
Frequently Asked Questions
Q: What CPU platform does the B8036G68V4E4HR-LE support?
A: It's built for AMD EPYC 7003 Series (3rd Gen) processors.
Q: What are the dimensions of the B8036G68V4E4HR-LE?
A: 26.77 x 17.26 x 1.69 inches (L x W x H), so confirm your chassis has matching clearance and standoff layout before ordering.
Q: How much does the B8036G68V4E4HR-LE weigh?
A: 23.50 lb as shipped — worth factoring into freight planning for multi-unit orders.
Q: Where is the B8036G68V4E4HR-LE manufactured?
A: The listed country of origin is China (CN).
Q: Is the B8036G68V4E4HR-LE (also searched as B8036G68V4E4HR LE) sold as a complete server or just the motherboard?
A: It's a server motherboard — you'll need to pair it with a compatible EPYC 7003 CPU, memory, and a chassis sized to its 26.77 x 17.26 in footprint.

The B8036G68V4E4HR-LE lands on my desk whenever someone's refreshing a recording backend and wants to move off an aging Xeon platform onto EPYC 7003. At 26.77 x 17.26 x 1.69 in and 23.50 lb, this is a full server-format board — don't try to squeeze it into a compact chassis.
Technical Highlights:
- AMD EPYC 7003 Series socket: gets you onto AMD's 3rd Gen server core architecture — the deciding factor if your workload is CPU-bound (transcoding, analytics processing) rather than just storage I/O bound.
- 26.77 x 17.26 in board footprint: this is a large-format server board — measure your chassis tray before you order, not after it arrives.
- 23.50 lb shipping weight: tells you this is a fully populated board with substantial VRM stages for EPYC's power draw, not a stripped-down reference design.
Deployment Considerations:
- Confirm your target EPYC 7003 CPU part number and TDP against the chassis cooling before final BOM lock — 3rd Gen EPYC parts span a wide TDP range and airflow requirements shift accordingly.
- Country of origin is listed as China — flag this early if you're submitting the build into a government or NDAA-scoped procurement process that screens board origin.
I'd spec the B8036G68V4E4HR-LE for a customer standing up a new VMS recording cluster who's already committed to EPYC 7003 for the core count and just needs a board sized right for their 4U rack chassis.
Compare with similar
Tyan B8036G68V4E4HR-LE AMD EPYC 7003 SERIES - 3RD GEN
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System Design, Deployment & Technical Support
Support services and planning resources for commercial surveillance, access control, and infrastructure deployments.
Fixed scope • Fixed price
System Design Assistance
- Get help validating product compatibility
- Coverage requirements
- Storage planning and deployment architecture before you buy.
Deployment & Configuration Support
- Access fixed-scope support for rollout planning
- User setup guidance
- Migration and system standardization across single-site or multi-site deployments
Guides, Tools & Calculators
- PoE requirements
- Storage retention
- Camera selection and deployment methodology