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SKU: 7XG7A06244
UPC: 889488461226
Condition: New
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Lenovo 7XG7A06244 SD530 Xeon 6140M 18C/140W/2.3GHZ

Lenovo 7XG7A06244 SD530 Xeon Gold 6140M 18-Core Processor Option KitOverviewThe Lenovo 7XG7A06244 is a factory-new processor option kit that equips th…

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Lenovo 7XG7A06244 SD530 Xeon 6140M 18C/140W/2.3GHZ

$7,669.00
$7,472.99

Overview

SKU: 7XG7A06244
UPC: 889488461226
Condition: New

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Questions about this product? Free pre-sales support from a senior specialist — product questions, compatibility checks, BOM quotes, price confirmation — typically answered within one business day. Need camera placement or system design work? Engineering time is $175 per hour (qty 1 = 1 hour). Hardware buyers get up to one hour ($175) credited back on their order.

Description

Lenovo 7XG7A06244 SD530 Xeon Gold 6140M 18-Core Processor Option Kit

Overview

The Lenovo 7XG7A06244 is a factory-new processor option kit that equips the Lenovo SD530 high-density sled server with an Intel Xeon Gold 6140M — an 18-core, 36-thread processor running at 2.3 GHz base with a 3.7 GHz boost frequency and a 140 W TDP. If you are scaling a dense compute cluster, a virtualization farm, or a video analytics back-end where the SD530's compact 1U half-width form factor is already in play, the 7XG7A06244 is the direct processor upgrade path without sourcing components outside the Lenovo supply chain.

The 6140M is Intel's server-optimized variant of the Skylake-SP Xeon Gold family, built on a 14 nm process and socketed to LGA 3647 (Socket P). It carries 24.75 MB of L3 cache and supports up to 1.5 TB of DDR4-SDRAM per processor — figures that matter when you are provisioning memory-heavy workloads like in-memory databases, large VM pools, or AI inference pipelines. Weighing 1.60 lb and dimensioned at 12.50 × 9.00 × 3.50 in as packaged, this kit is sized for straightforward installation into an existing dense rack server environment.

Key Features

  • 18 Cores / 36 Threads at 2.3 GHz Base: Each socket delivers 36 hardware threads, which translates directly into headroom for highly parallel workloads — virtualization schedulers, transcoding pipelines, and analytics engines all benefit from thread count before they benefit from raw clock speed. A dual-socket SD530 configuration brings 72 threads per sled.
  • 3.7 GHz Turbo Boost Frequency: The 1.4 GHz gap between base and boost means lightly threaded tasks — OS overhead, single-threaded management processes, burst workloads — accelerate automatically without manual tuning. That headroom matters in mixed-use deployments where the server runs both background services and occasional intensive jobs.
  • 24.75 MB L3 Cache: A large on-die cache reduces DRAM fetch latency for working sets that fit within it — particularly relevant for video management software (VMS) processing streams from dozens of concurrent camera feeds, or for analytics models that keep inference weights in-cache.
  • 140 W TDP — Cooler Included: At 140 W, the 6140M sits at the upper boundary of the Xeon Gold mid-tier power envelope. The kit ships with the cooler, so thermal solution compatibility with the SD530 chassis is already resolved — you are not sourcing a heatsink separately or hoping a third-party solution clears the sled clearance constraints.
  • 1.5 TB Maximum DDR4 Memory Support: Each processor supports up to 1.5 TB of DDR4-SDRAM across its memory channels. For a high-channel NVR back-end or AI compute sled handling large model weights, that ceiling is rarely a constraint at deployment time but eliminates re-architecting as data volumes grow.
  • LGA 3647 (Socket P) — Platform-Locked Upgrade: The SD530 uses Intel's Purley platform with Socket P. The 7XG7A06244 is the documented upgrade path within that ecosystem — no firmware surprises, no socket adapter, no compatibility ambiguity as long as the target sled is the SD530 running a supported firmware baseline.
  • 64-Bit Operating Mode, Skylake Microarchitecture: Full x86-64 instruction set support with AVX-512 extension availability means the processor can accelerate workloads that compilers and frameworks have been tuned for — including modern security analytics and machine learning inference libraries that target AVX-512 paths explicitly.
  • H0 Stepping, 14 nm Lithography: H0 is a mature, stable stepping of the Skylake-SP die. In production data centers and dense compute deployments, stepping consistency matters for predictable behavior across large node counts — you are not mixing untested silicon revisions into an established sled population.

Integration and Compatibility

The 7XG7A06244 is purpose-built for the Lenovo SD530 sled server platform. It is not a universal processor kit — the LGA 3647 socket and SD530 firmware baseline define the target. Before ordering, confirm the SD530's current firmware supports the 6140M's H0 stepping; Lenovo's ServerProven compatibility matrix is the authoritative reference for that check. The DDR4-SDRAM memory requirement means any existing SD530 DDR3 memory investment does not carry forward — though the SD530 platform is DDR4 native, so this is rarely a field issue.

For organizations building or expanding a physical security compute back-end — running a multi-server VMS cluster, an AI-driven video analytics node, or a centralized recording and storage tier — the SD530 with a 6140M processor provides the core compute density that keeps rack unit counts manageable. The processor's 36-thread capacity and large L3 cache are well-matched to concurrent-stream processing scenarios typical in enterprise surveillance infrastructure. Pair the SD530 with appropriate rack power and UPS infrastructure sized for the 140 W per-processor TDP plus memory and storage loads.

Frequently Asked Questions

Q: What server platform is the Lenovo 7XG7A06244 designed for?

A: The 7XG7A06244 is designed specifically for the Lenovo SD530 high-density sled server. It installs into the LGA 3647 (Socket P) processor socket on the SD530 platform. It is not a universal processor kit and is not compatible with other socket types.

Q: Does the 7XG7A06244 include a heatsink or cooler?

A: Yes. The kit includes a cooler, so you do not need to source a separate thermal solution for the SD530 chassis. This eliminates clearance and compatibility guesswork specific to the sled's tight internal geometry.

Q: What is the Xeon Gold 6140M's maximum memory per processor?

A: The Intel Xeon Gold 6140M supports up to 1.5 TB of DDR4-SDRAM per processor socket. In a dual-socket SD530 configuration, that ceiling applies per socket independently.

Q: What is the TDP for the Xeon Gold 6140M processor in this kit?

A: The 6140M has a Thermal Design Power (TDP) of 140 W. Size your rack PDU and UPS accordingly when planning power budgets for a fully populated SD530 chassis.

Q: What is the difference between the base and boost clock frequencies?

A: The 6140M runs at 2.3 GHz base frequency across all 18 cores under full load. Boost frequency reaches 3.7 GHz on lightly loaded cores, providing a 1.4 GHz headroom for bursty or single-threaded workloads without manual overclocking.

Q: Is the Xeon Gold 6140M suitable for video analytics or AI inference workloads?

A: The 6140M's 36 threads, 24.75 MB L3 cache, and AVX-512 instruction support make it a practical fit for concurrent-stream analytics and inference tasks. It is not a GPU-class accelerator, so for deep learning training at scale, a dedicated GPU node is the appropriate path — but for CPU-based inference and VMS processing, the 6140M handles high channel counts efficiently.

Karl Wilson
Karl Wilson

When I evaluate a processor upgrade kit for a dense sled environment, the first number I look at is TDP relative to the platform's cooling budget — and the 7XG7A06244's Xeon Gold 6140M at 140 W sits right at the upper edge of what the SD530 cooling subsystem is designed to manage. The included cooler removes one variable from that equation, but thermal planning at the rack level still matters: a fully populated SD530 chassis with dual 6140M processors is pushing 280 W in processor load alone before you factor in DIMMs and NVMe.

Technical Highlights:

  • 18 Cores / 36 Threads: In a VMS or analytics back-end, thread count is the resource that scales with concurrent camera stream processing. At 36 threads per socket, the 6140M can service a high channel-count deployment without saturating the scheduler — meaningful when you are running 100+ concurrent decode threads alongside storage I/O.
  • 3.7 GHz Boost Frequency: The 1.4 GHz headroom between base and boost is not cosmetic. Processes like index operations, metadata queries, and single-threaded VMS housekeeping tasks accelerate to 3.7 GHz automatically, keeping system responsiveness high even under background load.
  • 24.75 MB L3 Cache: For workloads that benefit from keeping inference model weights or video frame buffers close to the processor, 24.75 MB of on-die L3 is a real architectural advantage over lower-cache Xeon Silver options in the same socket family.

Deployment Considerations:

  • Confirm SD530 firmware compatibility with the 6140M H0 stepping before installation — Lenovo's ServerProven matrix is the definitive check. Running an unsupported stepping combination can surface errata that firmware has not patched.
  • At 140 W TDP, the 6140M requires that the SD530 chassis fan and airflow configuration is set correctly for the processor tier — do not assume a lower-TDP configuration's fan policy carries over without a firmware-level thermal profile update.

The 7XG7A06244 is the right choice for organizations expanding an existing SD530-based compute cluster — specifically where the workload is CPU-bound analytics, high-channel VMS processing, or virtualization density, and where adding a second processor to an already-deployed sled is more operationally efficient than provisioning a new node.

Specifications
Weight: 1.60 lb
Dimensions: 12.50 x 9.00 x 3.50 in (L x W x H)
Country Origin: MX
Country Of Origin: MX
Unspsc Code: 43201503
Processor model: 6140M
Processor base frequency: 2.3 GHz
Processor family: Intel® Xeon® Gold
Processor cores: 18
Processor socket: LGA 3647 (Socket P)
Component for: Server/workstation
Processor lithography: 14 nm
Processor threads: 36
Processor operating modes: 64-bit
Processor boost frequency: 3.7 GHz
Processor cache: 24.75 MB
Processor cache type: L3
Thermal Design Power (TDP: 140 W
Cooler included: Yes
Stepping: H0
Processor codename: Skylake
Maximum internal memory supported by processor: 1.5 TB
Memory types supported by processor: DDR4-SDRAM
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