Lenovo 4XG7A84160 SR650 V3 Gold 6426Y 16C 185W 2.5GHZ

Lenovo 4XG7A84160 Intel Xeon Gold 6426Y 16-Core Processor for ThinkSystem SR650 V3

Overview

The Lenovo 4XG7A84160 is a factory-configured Intel Xeon Gold 6426Y processor option for the ThinkSystem SR650 V3 server platform. Based on Intel's 4th Generation Xeon Scalable architecture, it delivers 16 physical cores (32 threads) at a base frequency of 2.5 GHz with turbo headroom up to 4.1 GHz — making it a practical fit for mixed enterprise workloads where both sustained throughput and burst responsiveness matter. The 185W TDP puts this squarely in the mid-range of the Xeon Gold lineup: enough compute density for demanding workloads without the power and cooling overhead of the higher-wattage Xeon Platinum tier.

The tray packaging (non-boxed) reflects data center procurement norms — this is a channel OEM component sourced through distribution for integration into ThinkSystem SR650 V3 configurations, not a retail standalone unit. Country of origin is Mexico.

Key Features

• 16 Cores / 32 Threads at 2.5 GHz Base: With 32 threads available to the OS, the 6426Y handles parallelized workloads — virtualization hosts, containerized microservices, database query processing — without core-count becoming the bottleneck. The base-to-boost range (2.5 GHz → 4.1 GHz) means latency-sensitive single-threaded tasks also get headroom.
• 4th Gen Intel Xeon Scalable (LGA 4677 / Socket E): The LGA 4677 socket is exclusive to 4th Gen Xeon Scalable processors. If you're planning a platform upgrade from a prior SR650 generation, verify socket compatibility — this processor will not drop into LGA 4189 (3rd Gen) motherboards.
• 37.5 MB L3 Cache: A large shared cache reduces main-memory access latency on data-intensive workloads. For in-memory analytics, database caching layers, or high-throughput network processing, the cache-to-core ratio here is meaningful for keeping hot datasets close to execution units.
• Hybrid Core Architecture — 4 High-Priority + 12 Standard Cores: Intel's performance-hybrid design on this generation assigns 4 cores to run at 2.7 GHz (high-priority) versus 2.5 GHz for the remaining 12. Workload schedulers that are core-aware can route latency-critical threads to the higher-frequency cores, giving VMs or processes priority access without manual tuning in all cases.
• 185W TDP — Thermal Planning Required: At 185W, the SR650 V3's cooling subsystem handles this without issue in its designed configuration, but data center planners should account for this in per-rack power budgets, especially in dual-socket configurations where total processor TDP doubles to 370W before DRAM, storage, and network loads are added.
• 16 GT/s System Bus Rate: The high-speed interconnect between processor and platform logic supports the memory bandwidth and I/O throughput that 4th Gen Xeon platforms are designed around — relevant for workloads that are memory-bandwidth-bound rather than purely compute-bound.
• 64-Bit Operation, Stepping S3: The S3 stepping reflects a mature production revision of the die — relevant for IT teams evaluating microcode errata exposure or managing fleet-wide BIOS compatibility. Check Lenovo's SR650 V3 firmware compatibility matrix for microcode version requirements before deployment.

Integration and Compatibility

The 4XG7A84160 is a Lenovo option part for the ThinkSystem SR650 V3 and must be installed in a compatible SR650 V3 system. It is not a universal Xeon component — Lenovo-branded processor options are validated against the SR650 V3's power delivery, BIOS firmware, and memory topology. Using this part outside of a Lenovo-validated SR650 V3 configuration is not supported and voids the system warranty. Confirm your SR650 V3's hardware configuration compatibility guide before ordering, particularly in dual-socket builds where both CPU slots must be populated with compatible TDP-matched processors. The LGA 4677 socket interface is mechanically and electrically distinct from prior Xeon socket generations — no backward compatibility with LGA 4189 (3rd Gen) or LGA 3647 (2nd Gen) platforms.

Frequently Asked Questions

Q: Is the Lenovo 4XG7A84160 compatible with ThinkSystem SR650 V2 servers?

A: No. The 4XG7A84160 uses the LGA 4677 (Socket E) interface for 4th Generation Intel Xeon Scalable processors. The SR650 V2 uses LGA 4189 (Socket P4) for 3rd Gen Xeon Scalable. These sockets are physically and electrically incompatible — this processor is validated for SR650 V3 only.

Q: What is the maximum boost frequency of the Xeon Gold 6426Y in the 4XG7A84160?

A: The processor boosts to 4.1 GHz under Intel Turbo Boost conditions. Base frequency is 2.5 GHz across all 16 cores, with 4 high-priority cores capable of 2.7 GHz sustained.

Q: Can this processor be used in a dual-socket SR650 V3 configuration?

A: The SR650 V3 supports dual-socket configurations, but both sockets must be populated with compatible, TDP-matched processors. Consult Lenovo's SR650 V3 configuration guide to confirm dual-socket processor pairing requirements before building a dual-CPU system.

Q: What does the tray package type mean for the 4XG7A84160?

A: Tray packaging means the processor ships without a retail box, heatsink, or fan — it is a channel OEM component intended for system integration. The SR650 V3 platform provides its own validated cooling solution; do not attempt to source a third-party heatsink.

Q: What is the TDP of the Xeon Gold 6426Y and what does that mean for power planning?

A: The thermal design power is 185W. In a dual-socket SR650 V3, processors alone account for up to 370W of the rack budget before storage, DRAM, and NIC loads are included. Size your PDU and UPS capacity accordingly.

James Everett

The 4XG7A84160 slots into a specific niche in the SR650 V3 lineup: a 16-core Xeon Gold 6426Y at 185W TDP that covers the majority of enterprise virtualization and general-purpose compute requirements without the cost and power overhead of higher-core-count Platinum-tier options. That 4.1 GHz boost ceiling is the spec I'd point to first for teams running mixed workloads where some VMs are latency-sensitive.

Technical Highlights:

• Hybrid Core Layout (4 HP + 12 LP): The 4 high-priority cores running at 2.7 GHz aren't just a marketing footnote — on workload schedulers that expose core affinity, you can pin latency-critical processes to those cores. Useful for real-time analytics or low-latency message queues running alongside heavier batch jobs on the same host.
• 37.5 MB L3 Cache: At roughly 2.3 MB per core, this is a healthy cache allocation for database and in-memory workloads. Keeps hot working sets out of DRAM, reducing memory subsystem pressure under concurrent VM load.
• 16 GT/s System Bus: 4th Gen Xeon's interconnect speed is the foundation for PCIe 5.0 and DDR5 bandwidth on the SR650 V3 platform. If you're pairing this with high-speed NVMe or 100GbE NICs, that bus rate is what allows those adapters to actually saturate their rated throughput.

Deployment Considerations:

• This is a Lenovo option part — procurement through a channel that sources direct from Lenovo's distribution network is important here. The tray format means there is no retail heatsink in the box; the SR650 V3 cooling infrastructure is the only validated thermal solution for this processor.
• At 185W, dual-socket SR650 V3 builds will draw significant power at the processor level alone. Budget at least 500–600W per 2U server slot at the PDU level once DRAM, NVMe, and networking are loaded — and verify your UPS capacity before commissioning a dense rack build.

This processor is well-matched for enterprise virtualization hosts running 20–40 VMs per socket, mid-tier database servers where the 4.1 GHz boost handles query bursts, and edge compute nodes where a balance of core count, clock speed, and power efficiency matters more than raw Platinum-tier throughput.