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SKU: 4XG7A84159
Condition: New
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Lenovo 4XG7A84159 SR650 V3 Gold 6442Y 24C 225W 2.6GHZ

Lenovo 4XG7A84159 Intel Xeon Gold 6442Y 24-Core Processor for ThinkSystem SR650 V3OverviewThe Lenovo 4XG7A84159 is a factory-new Intel Xeon Gold 6442Y…

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Lenovo 4XG7A84159 SR650 V3 Gold 6442Y 24C 225W 2.6GHZ

$13,621.99

Overview

SKU: 4XG7A84159
Condition: New

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Description

Lenovo 4XG7A84159 Intel Xeon Gold 6442Y 24-Core Processor for ThinkSystem SR650 V3

Overview

The Lenovo 4XG7A84159 is a factory-new Intel Xeon Gold 6442Y processor option for the ThinkSystem SR650 V3 — a 24-core, 4th Generation Intel Xeon Scalable CPU running at a 2.6 GHz base with a 4 GHz boost ceiling and a 225W thermal envelope. If you're provisioning SR650 V3 nodes for compute-dense workloads where you need a large thread count without pushing into the highest-tier power brackets, the 6442Y sits in a practical spot: 48 threads, 60 MB of L3 cache, and a hybrid core layout that lets the platform prioritize latency-sensitive tasks on the 8 high-priority cores (2.8 GHz) while the remaining 16 efficiency cores handle background or parallel throughput work.

This is a Lenovo-qualified processor option — meaning it's validated against the SR650 V3 platform firmware and thermal solution stack rather than a generic retail boxed part. The LGA 4677 (Socket E) interface is the standard mount for 4th Gen Xeon Scalable, and the 16 GT/s Intel UPI interconnect speed matters when you're running dual-socket configurations where cross-socket memory latency directly affects application performance. Note that no cooler is included with the 4XG7A84159 — thermal solution compatibility must be confirmed against your specific SR650 V3 chassis configuration before ordering.

Key Features

  • 24 Cores / 48 Threads: The 6442Y's 48-thread count handles parallel workloads — virtualization hosts running dozens of VMs, analytics pipelines, and multi-threaded database engines all benefit from the additional logical processor headroom compared to lower core-count options in the same family.
  • 2.6 GHz Base / 4.0 GHz Boost: The 1.4 GHz headroom between base and boost means single-threaded latency-sensitive tasks (license checks, real-time event processing, interactive query response) can reach significantly higher clocks when thermal and power headroom allow — without committing to the power draw of a higher base-frequency SKU full-time.
  • Hybrid Core Architecture — 8 High-Priority + 16 Standard Cores: The 8 high-priority cores run at 2.8 GHz base, separate from the 16 standard cores. For workloads that benefit from thread-type separation (foreground services vs. background batch), the platform's scheduler can steer latency-critical threads to the performance cluster. This is a 4th Gen Xeon feature that prior-generation SR650 configurations did not support.
  • 60 MB L3 Cache: Large L3 footprint reduces main-memory round trips for working datasets that fit within cache — beneficial for in-memory databases, caching tiers, and analytics queries over moderately sized hot data sets.
  • 225W TDP: The thermal design power defines your cooling and power delivery requirements. The SR650 V3 chassis is rated to handle this thermal envelope, but verify your specific rack power circuits and cooling airflow allocation, particularly in high-density deployments where multiple nodes share the same PDU branch.
  • 16 GT/s Intel UPI: In a dual-socket SR650 V3 configuration, UPI speed governs remote NUMA memory access latency. At 16 GT/s, cross-socket bandwidth is sufficient for most enterprise workloads, though memory-bandwidth-bound applications still benefit from NUMA-aware process pinning.
  • 64-Bit Operating Mode / LGA 4677 (Socket E): Standard 64-bit x86 execution with full compatibility across Linux and Windows Server workloads. LGA 4677 is the platform-locked socket for this CPU generation — not interchangeable with prior Xeon generations.

Integration and Compatibility

The 4XG7A84159 is validated for the Lenovo ThinkSystem SR650 V3 platform. As a server processor upgrade option, it installs into the primary or secondary CPU socket of the SR650 V3 chassis. Lenovo's platform validation process ensures firmware, BIOS, and thermal solution compatibility — a meaningful distinction from installing an unvalidated CPU into an enterprise server chassis where firmware microcode updates and thermal calibration tables may not align.

When planning a dual-socket deployment, confirm that both CPU sockets are populated with identical processor SKUs — mixed-SKU dual-socket configurations are not supported on this platform. Memory configuration (DIMM count, speed, and capacity) should be re-evaluated when upgrading from a lower-core-count processor, as memory population rules for maximum bandwidth may change. Consult the SR650 V3 compatibility matrix before finalizing your memory and storage bill of materials.

For integrators building out hyperconverged or virtualization clusters, this processor's thread count makes it a workable foundation for VMware vSphere or Microsoft Hyper-V environments with 20–40 concurrent VMs per node depending on per-VM resource allocation. Pair with appropriate server memory and NVMe storage for a balanced node configuration.

Frequently Asked Questions

Q: Is a CPU cooler included with the Lenovo 4XG7A84159?

A: No. The 4XG7A84159 does not include a cooler. You must confirm thermal solution compatibility with your SR650 V3 chassis configuration separately before installation.

Q: What server platform is the 4XG7A84159 validated for?

A: The 4XG7A84159 is validated for the Lenovo ThinkSystem SR650 V3. It installs into the LGA 4677 (Socket E) processor socket on that platform.

Q: Can the 4XG7A84159 be used in a dual-socket configuration?

A: The SR650 V3 supports dual-socket configurations. When deploying two processors, both sockets must be populated with identical CPU SKUs — mixed processor pairs are not supported.

Q: What generation is the Intel Xeon Gold 6442Y processor?

A: The 6442Y is a 4th Generation Intel Xeon Scalable processor from the Xeon Gold 6000 Series, fabricated on Intel's current platform with LGA 4677 socket interface and 16 GT/s UPI interconnect.

Q: What is the thermal design power (TDP) of the 4XG7A84159?

A: The Intel Xeon Gold 6442Y has a 225W TDP. Plan your rack power circuits and chassis cooling accordingly, particularly in high-density multi-node deployments.

Q: What is the maximum boost frequency of the 6442Y processor?

A: The processor boosts to 4.0 GHz on high-priority cores, up from a 2.6 GHz base — providing meaningful single-threaded performance headroom for latency-sensitive workloads.

Jerry Tildsen
Jerry Tildsen

The 4XG7A84159 is a platform-specific CPU option, not a commodity part — the distinction matters when you're commissioning SR650 V3 nodes for production workloads. The Intel Xeon Gold 6442Y's hybrid core layout (8 high-priority at 2.8 GHz base, 16 standard cores) is something integrators should factor into VM placement policies, not just treat as a straight 24-core count.

Technical Highlights:

  • 4.0 GHz Boost Ceiling: That 1.4 GHz spread between base and boost is real headroom for bursty workloads — real-time analytics, license servers, and interactive query engines all benefit when the thermal budget allows sustained boost.
  • 60 MB L3 Cache: For in-memory database workloads and hot-tier caching services, 60 MB of L3 keeps a meaningful working set off main memory — latency difference is measurable in OLTP benchmarks versus processors with half the cache.
  • 16 GT/s UPI at Dual Socket: Cross-socket memory latency in a dual 6442Y SR650 V3 config is governed by that UPI link speed. NUMA-aware workload placement still matters — don't assume UPI bandwidth removes the penalty entirely.

Deployment Considerations:

  • No cooler ships with this SKU — confirm your SR650 V3 thermal kit part number before the node goes into the rack. Missing this step on a data center deployment is a preventable delay.
  • 225W TDP per socket adds up fast in a blade-dense row. Audit your PDU branch circuit capacity and per-chassis airflow allocation before committing to a multi-node order at this power level.

This processor is the right pick for SR650 V3 nodes anchoring mid-scale virtualization clusters or analytics workloads where you need 48 threads and a 4 GHz burst ceiling without stepping into the 270W+ power tier — a realistic fit for enterprise VDI hosts or multi-tenant Kubernetes worker nodes where per-node power budget is a real constraint.

Specifications
Weight: 2.00 lb
Unspsc Code: 43201503
Processor manufacturer: Intel
Processor generation: Intel Xeon Scalable 4th Gen
Processor model: 6442Y
Processor base frequency: 2.6 GHz
Processor family: Intel® Xeon® Gold
Processor cores: 24
Processor socket: LGA 4677 (Socket E)
Processor series: Intel Xeon Gold 6000 Series
Processor threads: 48
Intel® UPI Speed: 16 GT/s
Processor operating modes: 64-bit
Processor boost frequency: 4 GHz
High priority cores: 8
High priority core frequency: 2.8 GHz
Low priority cores: 16
Processor cache: 60 MB
Thermal Design Power (TDP: 225 W
Cooler included: No
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