Lenovo 4M17A61253 SD630 V2 RAIL KIT
Lenovo 4M17A61253 SD630 V2 RAIL KIT
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Overview

SKU: 4M17A61253
Condition: New
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Lenovo 4M17A61253 SD630 V2 Rail KIT

Lenovo 4M17A61253 SD630 V2 Rail Kit Overview The Lenovo 4M17A61253 is a rail kit specifically designed for the ThinkSystem D3 Chassis. This accessory …

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Lenovo 4M17A61253 SD630 V2 Rail KIT

$954.99
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Overview

SKU: 4M17A61253
Condition: New

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Description

Lenovo 4M17A61253 SD630 V2 Rail Kit

Overview

The Lenovo 4M17A61253 is a rail kit specifically designed for the ThinkSystem D3 Chassis. This accessory enables the secure and proper installation of a 2U rack-mounted chassis within standard server racks, facilitating efficient cooling and cable management for the enclosed server nodes. It is essential for integrating the D3 Chassis into existing or new data center infrastructure.

Compatibility

This rail kit is engineered for the ThinkSystem D3 Chassis, a 2U high enclosure. It supports the installation of up to four SD530 V3 server nodes within a single D3 chassis. The chassis itself can accommodate mixed server node types, including SD535 V3 and SD550 V3, though this rail kit is directly associated with the D3 enclosure that houses them.

Installation Notes

The rail kit requires standard 19-inch rack mounting. Ensure sufficient depth in your rack for the chassis's 898 mm (35.36 inches) depth. The kit facilitates a sliding mechanism for easy access to the servers within the D3 chassis. Each server node within the chassis draws power from the chassis's redundant power supplies, which are hot-swappable. The weight of the rail kit itself is 10.00 lb, and the fully populated chassis will be significantly heavier, requiring careful rack load planning.

Expert Analysis
Specifications
Weight: 10.00 lb
Unspsc Code: 43211600
Components: Specification
Machine Type: 7DD0 - 3 year warranty 7DD7 - 1 year warranty
Form Factor: 2U rack-mounted chassis
Supported Enclosure: ThinkSystem D3 Chassis, 2U high; up to 4 servers per chassis.
Chipset: Intel C741 "Emmitsburg" chipset, part of the platform codenamed "Eagle Stream"
Persistent Memory: Not supported
Memory Maximums: Up to 1TB of system memory (using either 8x 128GB 3DS RDIMMs or 16x 64GB RDIMMs)
Drive Bays: 2x E3.S 1T EDSFF hot-swap drive bays supporting PCIe 5.0 x4 NVMe drives 2x onboard M.2 slots supporting NVMe drives (x1 host interface) or SATA drives (6Gbps host interface)
Maximum Internal Storage: 122.88TB using 2x 61.44TB E3.S EDSFF NVMe SSDs
Storage Controller: 2x Onboard NVMe ports (Optional Intel VROC NVMe for RAID)
Optical Drive Bays: No internal bays; use an external USB drive.
Tape Drive Bays: No internal bays. Use an external USB drive.
Pcie Slots: One PCIe 5.0 x16 slot with low profile form factor
Gpu Support: Supports 1x single-wide GPU
Ports: None.
Cooling: None. Fans are located within each server node.
Power Supply: Supplied by the D3 Chassis.
Hot-Swap Parts: Power supplies
Systems Management: None. Management is provided by each node. An incoming remote management connection can be shared using a daisy chain connection.
Security: Power-on password, administrator's password, Trusted Platform Module (TPM), supporting TPM 2.0.
Ambient Temperature: Up to ASHRAE Class A2: 10°C - 35°C (50°F - 95°F)
Dimensions: Height: 87 mm (3.43 inches), depth: 898 mm (35.36 inches), width: 448 mm (17.64 inches). See Physical and electrical specifications for details.
Server Support: Up to four SD535 V3 servers per chassis Up to four SD530 V3 servers per chassis Up to two SD550 V3 servers per chassis Servers can be mixed in the same chassis
Servers Per Rack: Up to 84x SD530 V3 servers in 21 chassis per 42U rack Up to 96x SD530 V3 servers in 24 chassis per 48U rack
I/O Architecture: None integrated. Use top-of-rack networking and storage switches.
Power Cords: One AC power cord for each power supply, C13 or C19 depending on the power supplies selected
Enclosure Leds: Each power supply has AC, DC and error LEDs.
Machine Type/Model General Purpose: Machine Type/Model for HPC and AI
7Dd3Cto1Ww: 7DD3CTOLWW
7Dd3Ctoaww: 7DD3CTOHWW
7Ddacto1Ww: 7DDACTOLWW
Feature Code: Description
By6V: ThinkSystem SD530 V3 Node
7Dd0Cto1Ww: 7DD0CTOLWW
7Dd7Cto1Ww: 7DD7CTOLWW
Bwjw: ThinkSystem D3 2U Enclosure Base
4Xg7A91891: BYVP
4Xg7A91889: BYW6
Cto Only: C91V
4Xg7A91901: BYVW
4Xg7A91887: BYW7
4Xg7A91899: BYVX
4Xg7A91895: BYW0
4Xg7A91904: BYVQ
Cpu Model: Default accelerators and SGX Enclave
Qat: DLB
4514Y: 0
4516Y: 1
5512U: 0
6526Y: 0
6538N: 2
6538Y: 1
6542Y: 0
6544Y: 0
6548N: 2
6548Y: 1
6554S: 4
8558P: 1
8558U: 0
8562Y: 1
8568Y: 1
8571N: 4
8581V: 1
8592V: 1
4L47A89451: BX9C
4L47A89452: BX9D
4L47A89453: BX9A
4L47A89454: BX9B
4L47A89455: BX9E
Css4 (4Xqat, 4Xdlb, 4Xdsa: AS4 (4xDSA, 4xIAA)
Bfyb: Operating mode selection for: "Maximum Performance Mode"
Bfyc: Operating mode selection for: "Minimal Power Mode"
Bfyd: Operating mode selection for: "Efficiency Favoring Power Savings Mode"
Bfye: Operating mode selection for: "Efficiency - Favoring Performance Mode"
4X77A88049: BWHW
4X77A88052: BWHS
4X77A88058: BWHV
4X77A93887: C4EA
4X77A88051: BWJC
4X77A88056: BWSL
4X77A88057: BWJD
4X77A88054: BWHU
4Ta7A91723: BY79
Bs7Q: On Board SATA Software RAID Mode for M.2
Bz4X: Intel VROC RAID1 Only for M.2
Bs7M: Intel VROC (VMD NVMe RAID) Standard for M.2
7S0A007Fww: S874
7S0A008Vww: SDJR
7S0A008Www: SDJS
7S0A008Xww: SDJT
7S0A007Hww: S876
7S0A008Yww: SDJU
7S0A008Zww: SDJV
7S0A0090Ww: SDJW
7S0A007Kww: S878
7S0A0091Ww: SDJX
7S0A0092Ww: SDJY
7S0A0093Ww: SDJZ
7S0A007Mww: S87A
7S0A0094Ww: SDK0
7S0A0095Ww: SDK1
7S0A0096Ww: SDK2
7S0A007Pww: S87C
7S0A0097Ww: SDK3
7S0A0098Ww: SDK4
7S0A0099Ww: SDK5
4L47A92670: BZ4W
4L47A83669: BR9B
4Xb7A13974: BVTG
4Xb7A83764: BVTF
4Xb7A83763: BVTE
4Xb7A84039: BNER
4Xb7A93131: C1W8
4Xb7A93132: C1W9
4Xb7A93133: C1WA
4Xb7A93134: C1WB
4Xb7B11623: CCZR
4Xb7B11624: CCZQ
4Xb7A93078: C1AF
4Xb7A93079: C1AE
4Xb7A93080: C1AB
4Xb7A93081: C1WU
4Xb7A93810: C0R2
4Xb7A93811: C0R3
4Xb7A93812: C0R4
4Xb7A93813: C0R5
4Xb7A84129: BVTD
4Xb7A84130: BVEJ
4Xb7A84131: BVEK
4Xb7A84132: BVEL
4Xb7B07587: CAC9
4Xb7B07588: CABU
4Xb7B07589: CACA
4Xb7A89422: BYF7
4Xb7A82286: BQ1Z
4Xb7A90118: BYTD
4Xb7A90119: BYTE
4Xb7A90120: BYTF
7Xa7A05926: AVV8
4Ta7A91724: ThinkSystem SD550 V3 SD530 V3 Rear OCP Kit
4Ta7A90733: BY77
4Ta7A90732: BY76
4Xf7B06188: ThinkSystem OCP3 FILLER
4Xc7A08277: B93E
4Xc7A88428: BW97
4Xc7A08236: B5ST
4Xc7A08278: BCD5
4Xc7A80268: BPPY
4Xc7A08237: BN2T
4Xc7A80567: BPPW
4Xc7A08294: BCD4
4Xc7A80269: BP8L
4Xc7A62582: BE4T
4Xc7A08243: BPPX
7Zt7A00535: AUZW
7Zt7A00496: AUKP
4Xc7A80266: BNWL
4Xc7A79699: BMXB
4Xc7A08238: BK1H
4Xc7A80566: BNWM
4Xc7A08295: BCD6
4Xc7A62580: BE4U
4Xc7A08297: BK1J
4Xc7A08248: B8PP
4C57A14177: B4R9
4C57A15326: B4RC
4Xc7A81883: BQBN
01Cv840: ATZV
4Xc7A76525: BJ3H
4Xc7A08276: BA1F
4Y37A09724: B8P7
4X67A86130: BU00
4X67A84824: BS2C
4P57A87628: C2Y9
4P57A87750: C04Q
4P57A95707: C2NC
4P57A87629: BYF6
4P57A89327: BYF2
4P57A89328: BYF3
4P57A89329: BYF4
4P57A89330: BYF5
Market/Region: Part number
Worldwide: 47C2494
Argentina: Bolivia Chile Colombia Ecuador Mexico Peru Paraguay Uruguay Venezuela
Australia/Nz: 81Y2383
Brazil: (None)
China: (None)
Europe: 81Y2376
India: 81Y2386
Israel: 39Y7920
Italy/Chile: 81Y2380
South Africa: 81Y2379
South Korea: 81Y2385
Switzerland: 81Y2390
Taiwan: Hong Kong Korea (the Republic of)
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