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Description

Panduit CMP-300-1 Copper Joint Compound 8oz

Overview

The Panduit CMP-300-1 is an 8-ounce electrical joint compound formulated for copper-to-copper (CO-CO) and copper-to-steel (CO-ST) terminations. Applied at connection points before fastening lugs, compression connectors, or bus bar joints, it fills microscopic surface voids, displaces moisture, and inhibits oxidation — the primary cause of resistance creep at high-current terminations over time. If you're commissioning switchgear, panel terminations, or grounding conductors and want those joints to hold their contact resistance years down the line, this is a standard prep step that costs very little relative to a callback.

The CMP-300-1 (often searched as CMP 300 1) ships in a single 8oz unit, sized appropriately for a typical service panel or switchboard termination job without leaving large quantities of opened compound to degrade on the shelf.

Key Features

  • High Flash Point (>260 °C): The compound won't ignite during normal installation or energized termination work — relevant when working near live bus or in warm switchgear enclosures where ambient temperatures can be elevated.
  • CO-CO and CO-ST Coverage: One product handles both copper-to-copper and copper-to-steel joint types, so installers don't need to stock separate compounds for mixed-metal bus applications — common in commercial panelboards and grounding systems.
  • Oxidation Inhibition: Copper oxidizes at exposed surfaces; the compound seals the interface from air and moisture ingress, maintaining low contact resistance at the joint over the service life of the installation.
  • 8oz Single-Pack Format: Right-sized for small to mid-scale panel work. Avoids the waste and shelf-life concerns of larger bulk containers on jobs where only a moderate number of terminations need treatment.

Integration & Compatibility

The CMP-300-1 is designed for use with Panduit copper compression lugs, connectors, and bus bar termination hardware, and is broadly applicable wherever CO-CO or CO-ST joints are made in commercial electrical and low-voltage infrastructure installations. Consult the applicable connector installation instructions to confirm whether joint compound is specified for the termination type.

Frequently Asked Questions

Q: What joint types is the CMP-300-1 designed for?

A: The CMP-300-1 is formulated for copper-to-copper (CO-CO) and copper-to-steel (CO-ST) terminations.

Q: What is the flash point of the CMP-300-1 compound?

A: The flash point is greater than 260°C, making it safe for use in typical electrical installation environments.

Q: How much compound is included per package?

A: Each CMP-300-1 package contains one 8-ounce (8oz) container.

Q: Can the CMP-300-1 be used on aluminum conductors?

A: The product is specified for CO-CO and CO-ST (copper-to-copper and copper-to-steel) applications. For aluminum or aluminum-to-copper joints, consult Panduit's product line for the appropriate compound designation.

Ted Perry
Ted Perry

The Panduit CMP-300-1 is a straightforward electrical consumable, but skipping joint compound on high-current copper terminations is the kind of shortcut that shows up years later as a hot connection or nuisance trip. The >260°C flash point means you're not introducing a fire hazard into switchgear work — that's not a trivial spec when you're torquing lugs in a warm 480V panel.

Technical Highlights:

  • Flash Point >260°C: Eliminates ignition risk during installation near energized bus or in enclosed switchgear where ambient heat accumulates — a practical safety margin for field use.
  • Dual-substrate formulation (CO-CO / CO-ST): Covers both copper-to-copper and copper-to-steel joints with a single product, which simplifies the consumables kit for installers working mixed-metal termination points in commercial panelboards and grounding arrays.
  • 8oz single-pack: The per-pack format is well-matched to service panel or switchboard jobs; avoids opening a large container that degrades once exposed to air over multiple jobs.

Deployment Considerations:

  • Apply a thin, even coat to the contact surfaces of both connector and conductor before compression or torque — excess compound squeezed out of the joint doesn't add protection and can attract debris.
  • The CMP-300-1 is rated for CO-CO and CO-ST only — do not substitute for aluminum-rated compound (AL-CU joints require a different formulation with more aggressive abrasive content to break through aluminum oxide).

This compound is the right call for commercial electrical infrastructure work — switchgear terminations, grounding conductors, and bus bar joints — where long service intervals make oxidation resistance at the connection point genuinely worth the two-minute prep step.

Specifications
Flash Point: > 260 °C
Acute Toxicity Oral: 500 mg/kg body weight
Copper OEL TWA: 0.2 mg/m³
Copper PEL TWA: 0.1 mg/m³
Copper PEL Dust Mist: 1 mg/m³
Copper IDLH: 100 mg/m³
Copper REL TWA: 1 mg/m³
Copper REL Fume: 0.1 mg/m³
Thiadiazole ATE Gases: 4500 ppmV/4h
Thiadiazole ATE Vapors: 11 mg/l/4h
Thiadiazole ATE Dust Mist: 1.5 mg/l/4h
Copper LC50 Fish: 0.0068 – 0.0156 mg/l
Copper EC50 Crustacea: 0.03 mg/l
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Panduit JOINT COMPOUND CO-CO / CO-ST 8OZ PK1 - CMP-300-1

$115.03
$84.99

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