Panduit GB2B0312TPI-1 StructuredGround™ Grounding Bar
The Panduit GB2B0312TPI-1 StructuredGround™ grounding bar delivers BICSI and ANSI/TIA-607-D compliant network equipment grounding for datacenter and telecommunications installations. This 20-inch bar is machined from high-conductivity copper and tin-plated to resist corrosion in demanding environments. Pre-assembled with mounting brackets and 600V-rated insulators, it eliminates field assembly time and ensures proper electrical isolation from rack or wall structures. The 0312 hole-spacing configuration accommodates standard compression lugs for bonding network racks, cable trays, and telecommunications equipment to your facility ground system. cULus certification confirms compliance with NEC grounding and bonding requirements for commercial low-voltage installations.
Key Features
- BICSI and ANSI/TIA-607-D compliant grounding bar for telecom and network equipment installations
- High-conductivity copper construction with tin-plated finish to inhibit corrosion
- Pre-assembled with mounting brackets and 600V-rated insulators for fast, code-compliant installation
- 20-inch length with 0312 hole spacing accommodates multiple bonding connections
- cULus certified grounding and bonding equipment per NEC requirements
- Accepts Panduit laser/inkjet printable labels for circuit identification
The GB2B0312TPI-1 addresses the grounding and bonding requirements specified in BICSI TDMM and ANSI/TIA-607-D Telecommunications Bonding and Grounding for Customer Premises. The bar's high-conductivity copper core provides the low-impedance path required for effective fault current dissipation and electromagnetic interference (EMI) control. Tin plating inhibits oxidation and maintains consistent contact resistance across compression lug terminations over the equipment lifecycle. The fixed insulators provide 600-volt isolation between the grounding bar and its mounting surface, preventing unintended current paths through building steel or rack structures. This isolation is essential for maintaining a star-point grounding topology and avoiding ground loops that can introduce noise into sensitive network equipment.
In datacenter and telecommunications room deployments, the GB2B0312TPI-1 serves as the central bonding point for equipment racks, cable trays, overhead ladder rack, and individual network devices. Install one bar per equipment row or zone, bonded back to your telecommunications main grounding busbar (TMGB) or telecommunications grounding busbar (TGB) via 6 AWG or larger conductors per TIA-607-D Table 2. The 0312 hole spacing accepts standard compression lugs from 2 AWG through 14 AWG, accommodating both heavy feeder conductors and individual equipment bonds. Pre-assembled brackets mount to standard 19-inch racks, plywood backboards, or wall surfaces using the integrator's choice of hardware. For installations requiring labeling per NEC 250.122, the bar's smooth surface accepts Panduit's printable label tape for clear circuit identification during inspections and troubleshooting.
The StructuredGround system brings the same engineered-system approach to grounding and bonding that Panduit applies to structured cabling—pre-engineered components, clear installation standards, and third-party certification. The GB2B0312TPI-1's cULus listing confirms independent verification of manufacturing quality and electrical performance against UL 467 (Grounding and Bonding Equipment). This certification streamlines AHJ approval during permit inspections and demonstrates compliance with NEC Article 250 grounding requirements for commercial installations. For integrators building BICSI-compliant structured cabling systems or meeting datacenter infrastructure standards like TIA-942, the GB2B0312TPI-1 provides the documented, certifiable grounding infrastructure your low-voltage installation requires.
