Tyan S5642AGMNRE Small Form Factor Server Board

Overview

The Tyan S5642AGMNRE is a small form factor (SFF) server board built around 3rd Generation Intel Xeon Scalable processors. It targets deployments where rack or enclosure depth is limited but server-class processing still needs to fit — edge compute nodes, compact recording servers, and dense installations where a full-depth chassis isn't an option. At 3.50 x 14.00 x 15.00 in and roughly 5.00 lb, the S5642AGMNRE is built to slot into shallower enclosures without giving up the platform features integrators expect from a 3rd Gen Xeon SP design.

This board is a fit for system builders and integrators assembling surveillance recording servers, VMS hosts, or edge appliances where physical space is the constraint driving the platform choice, not raw compute ceiling. If you're speccing a rack-mount recording server for a network video recorder deployment and standard ATX or E-ATX depth doesn't clear your rack, the SFF form factor on the S5642AGMNRE is the relevant spec to evaluate first.

Key Features

• Small Form Factor (SFF) footprint: At 3.50 x 14.00 x 15.00 in, the S5642AGMNRE fits shallower chassis and edge enclosures where a standard server board footprint won't clear the available depth — relevant when you're retrofitting compute into an existing rack or a compact wall-mount enclosure.
• 3rd Gen Intel Xeon Scalable Processor support: Building on the Xeon SP platform gives you access to the memory bandwidth and PCIe lane counts that class of processor provides, which matters when the board is feeding multiple storage controllers or high-throughput NICs in a recording server build.
• 5.00 lb board weight: Light enough that it doesn't add meaningful load to a populated chassis, worth noting when you're calculating total shipped weight for a fully built system.
• Country of origin CN: Relevant for procurement teams tracking supply chain origin documentation on federal or state contract bids.

Integration & Compatibility

The S5642AGMNRE is a server-class board, not a drop-in consumer part — plan chassis selection, power delivery, and cooling around the 3rd Gen Xeon SP platform's requirements before finalizing a build. Because it's an SFF design, verify your target chassis's internal clearance against the board's 3.50 x 14.00 x 15.00 in dimensions before ordering, especially depth-constrained enclosures used in NVR and edge-compute builds. For teams speccing full recording servers around this board, a PoE switch selection and a review of a storage and retention guide will round out the platform decision alongside the Tyan board itself.

Integrators building out a full Tyan server board catalog deployment should confirm processor, memory, and PCIe card compatibility directly against the 3rd Gen Xeon SP compatibility list before finalizing a bill of materials — the S5642AGMNRE's SFF layout means card clearance and slot count are tighter than a full-size board, so oversized GPU or capture cards should be checked against the chassis first. For broader platform planning across a server hardware refresh, treat form factor as the first filter and processor generation as the second.

Frequently Asked Questions

Q: What processor generation does the S5642AGMNRE support?

A: The Tyan S5642AGMNRE is built for 3rd Generation Intel Xeon Scalable Processors.

Q: What is the form factor of the S5642AGMNRE?

A: It's a Small Form Factor (SFF) board measuring 3.50 x 14.00 x 15.00 in.

Q: How much does the S5642AGMNRE weigh?

A: The board weighs approximately 5.00 lb.

Q: Where is the S5642AGMNRE manufactured?

A: Country of origin is listed as CN (China).

Marty Allison

The S5642AGMNRE is one of those boards that gets picked for a single reason: it's SFF, and the chassis you already own isn't. When 3rd Gen Xeon SP compute needs to fit into a 3.50 x 14.00 x 15.00 in footprint, this is the board that gets the spec sheet out of the way.

Technical Highlights:

• SFF footprint (3.50 x 14.00 x 15.00 in): This is the board's whole reason for existing — it clears depth-constrained enclosures that a full-size Xeon SP board simply won't fit into.
• 3rd Gen Intel Xeon Scalable platform: Gives you the PCIe lane count and memory bandwidth that class of processor delivers, without needing a full-depth chassis to house it.
• 5.00 lb board weight: Light enough that it's a non-factor in a fully populated system's shipping weight calculation.

Deployment Considerations:

• Before you order, physically check your chassis's internal clearance against the 3.50 x 14.00 x 15.00 in footprint — SFF boards can still bump into drive cages or PSU brackets that weren't designed around this exact layout.
• SFF layouts trade card slot count and spacing for footprint, so if your build needs multiple full-height PCIe cards (capture cards, HBAs, high-port NICs), map your card count against the board's slot layout before committing S5642AGMNRE, not after.

The scenario this board earns its keep in: a compact recording server or edge-compute node going into a rack or enclosure that was never sized for a full-depth Xeon SP board — where SFF is the requirement, not a nice-to-have.