Lenovo 4XG7A86663 SR650 V3 DWC Processor Module KIT

Lenovo 4XG7A86663 SR650 V3 DWC Processor Module Kit

Overview

The Lenovo 4XG7A86663 is a processor module kit designed for direct water-cooled (DWC) configurations of the ThinkSystem SR650 V3 rack server. This kit provides the hardware components required to seat and commission a processor in a DWC thermal architecture — where air-cooled heatsinks are replaced by liquid-cooled cold plates, enabling sustained compute throughput in high-density data center rows where rack-level thermal loads exceed what forced-air cooling can reliably manage. If you are expanding or replacing processor capacity in an SR650 V3 DWC chassis, 4XG7A86663 supplies the module-level components to complete that installation correctly.

Compatibility

Designed specifically for the Lenovo ThinkSystem SR650 V3 configured with direct water cooling (DWC). The SR650 V3 platform supports dual-socket Intel Xeon Scalable (4th Gen) processors; this kit is paired to the DWC thermal subsystem of that platform. It is not interchangeable with air-cooled SR650 V3 heatsink kits, nor compatible with prior-generation SR650 or SR650 V2 chassis. Verify your SR650 V3 order code reflects DWC configuration before installing this module kit — mixing air-cooled and DWC processor hardware within the same chassis is not supported.

Installation Notes

Installation must follow Lenovo ThinkSystem SR650 V3 DWC service procedures. The DWC cold plate assembly involves manifold connections that must be fully seated and leak-tested before powering the system. Ensure the facility's coolant loop meets Lenovo's inlet temperature and flow-rate specifications for the SR650 V3 DWC platform. This is a field-service or data center technician installation — not a tool-free operation. Consult the SR650 V3 Hardware Maintenance Guide for torque specifications on cold plate fasteners and processor socket procedures.