Lenovo 4XG7A63412 SR630 V2 Gold 5317 12C 150W 3.0GHZ

Lenovo 4XG7A63412 Xeon Gold 5317 12-Core Processor for ThinkSystem SR630 V2

Overview

The Lenovo 4XG7A63412 is a factory-configured processor option for the ThinkSystem SR630 V2 — Lenovo's 1U dual-socket rack server aimed at compute-dense enterprise workloads. This option installs the Intel Xeon Gold 5317 (Ice Lake, 3rd Generation Xeon Scalable) into an SR630 V2 chassis, delivering 12 cores at a 3.0 GHz base clock with a 3.6 GHz boost ceiling, all within a 150W TDP envelope. For organizations sizing compute for rack server deployments, this processor strikes a balance between per-core throughput and power budget — useful when you need predictable sustained performance across multi-threaded workloads without the heat signature of higher-wattage Xeon Platinum parts.

The LGA 4189 socket and Ice Lake microarchitecture bring PCIe 4.0 fabric support and improved memory bandwidth to the SR630 V2 platform, making the 4XG7A63412 a relevant choice for environments running virtualized workloads, video analytics processing, or AI-inference edge tasks where the platform — not just the CPU clock — matters. Browse the full Lenovo server and compute catalog for compatible SR630 V2 accessories and expansion options.

Key Features

• 12 Cores / 24 Threads at 3.0–3.6 GHz: The Xeon Gold 5317 runs 24 concurrent threads with a base frequency of 3.0 GHz and a Turbo Boost ceiling of 3.6 GHz. In practice, workloads that are both thread-count-sensitive and latency-sensitive — enterprise middleware, container orchestration, real-time analytics — benefit from the combination of core count and clock headroom without requiring the higher TDP of a 28-core Platinum part.
• 150W TDP in a 1U Chassis: At 150W, this processor fits within the SR630 V2's thermal design without forcing custom cooling modifications. That matters in dense rack deployments where per-U power allocation and rack PDU capacity are constrained — a 150W ceiling here leaves headroom on the rack circuit for storage, networking, and redundant power supplies.
• 18 MB L3 Cache: The 18 MB of last-level cache reduces round-trips to main memory on working-set-heavy applications. For video management software running frame-level analytics or database-backed workloads with hot data sets, keeping frequently accessed data resident in cache has a direct impact on throughput without additional tuning.
• Up to 6 TB Maximum Memory Support: The Ice Lake platform's memory controller supports up to 6 TB of addressable RAM across the SR630 V2's DIMM slots — relevant for in-memory databases, large-scale virtualization, or any workload where swapping to storage is unacceptable. Not every SR630 V2 configuration will be populated to that ceiling, but the headroom is there if requirements grow.
• 11.2 GT/s System Bus: The UPI interconnect running at 11.2 GT/s supports low-latency communication in a dual-socket configuration — if the SR630 V2 is populated with two processors, coherent cache traffic between sockets travels at full rated bandwidth without a bottleneck at the fabric layer.
• 10 nm Ice Lake Lithography: The Ice Lake process node delivers better performance-per-watt compared to the previous Cascade Lake 14 nm generation. For always-on server workloads measured by annual power consumption and cooling costs, the efficiency improvement is a real operational factor — not just a spec sheet footnote.
• 64-bit Operating Mode: Full 64-bit instruction support is table stakes for modern enterprise OS and hypervisor deployments (VMware ESXi, RHEL, Windows Server), but it's worth confirming in procurement — this processor fully supports 64-bit operating modes required by all current enterprise platforms.

Integration & Compatibility

The 4XG7A63412 is designed as a rack server processor upgrade specifically for the ThinkSystem SR630 V2 platform. The LGA 4189 socket is exclusive to 3rd Generation Intel Xeon Scalable (Ice Lake-SP) processors — it is not backward-compatible with Cascade Lake or Cooper Lake parts, and not forward-compatible with Sapphire Rapids. Verify that the SR630 V2 chassis firmware (UEFI/XCC) is updated to support Ice Lake processors before installing; Lenovo publishes minimum firmware levels for mixed-generation upgrades in their ServerProven documentation.

For environments running video surveillance workloads — NVR software, video analytics engines, or AI-based detection pipelines — the combination of 12 cores, 24 threads, and 6 TB memory addressability makes this platform viable for consolidating multi-stream processing onto fewer physical nodes. Pair with appropriate network switching infrastructure to ensure the upstream bandwidth matches the server's throughput capability.

Frequently Asked Questions

Q: What server platform is the Lenovo 4XG7A63412 compatible with?

A: The 4XG7A63412 is designed for the Lenovo ThinkSystem SR630 V2 server. It installs the Intel Xeon Gold 5317 into the LGA 4189 socket, which is exclusive to 3rd Generation Intel Xeon Scalable (Ice Lake-SP) processors. It is not compatible with earlier SR630 (V1) chassis using LGA 3647 sockets.

Q: What is the core count and base frequency of the Xeon Gold 5317 in this option?

A: The Intel Xeon Gold 5317 provides 12 cores and 24 threads with a base frequency of 3.0 GHz and a maximum Turbo Boost frequency of 3.6 GHz, all within a 150W TDP.

Q: How much memory does this processor support?

A: The Xeon Gold 5317 Ice Lake platform supports up to 6 TB of maximum internal memory, subject to the SR630 V2 chassis DIMM slot configuration and memory module choices.

Q: Is the 4XG7A63412 a single-processor or dual-processor option?

A: The 4XG7A63412 is a single-processor option. The SR630 V2 supports dual-socket configurations; a second processor of the same type can be added separately if symmetric dual-socket compute is required.

Q: What is the processor cache size on the Xeon Gold 5317?

A: The Xeon Gold 5317 includes 18 MB of L3 last-level cache, which helps sustain throughput on working-set-intensive workloads by reducing main memory round-trips.

Jerry Tildsen

The Lenovo 4XG7A63412 slots the Xeon Gold 5317 into the SR630 V2 at a 150W TDP — a deliberate design point that keeps this processor deployable in standard 1U rack environments without requiring upgraded PDUs or specialized cooling beyond the SR630 V2's rated configuration. For integrators building out compute infrastructure to host VMS platforms or analytics engines, that thermal ceiling is often the deciding spec before clock speed even enters the conversation.

Technical Highlights:

• 3.0–3.6 GHz Turbo Range: The 600 MHz of boost headroom above base clock matters on workloads with bursty single-threaded demand — license-plate recognition, motion detection triggers, alert processing — where a brief spike in frequency directly reduces latency without sustained TDP impact.
• 24 Threads on 12 Cores: Hyperthreading at 12 physical cores means a well-tuned hypervisor or container platform can schedule 24 concurrent execution contexts. For VMS installations running multiple analytics instances alongside the core recording engine, the thread count reduces contention without requiring a second socket.
• 6 TB Memory Ceiling: The Ice Lake memory controller's 6 TB addressability is not typical of mid-range Xeon Gold parts — it enables in-memory processing at a scale that would otherwise require Xeon Platinum. For AI inference pipelines or large-frame-buffer video analytics, that headroom matters when sizing for 3–5 year growth.

Deployment Considerations:

• Verify SR630 V2 UEFI and XCC firmware versions before installing — Lenovo has documented minimum firmware levels required for Ice Lake processor support, and running an outdated BMC with an Ice Lake CPU can result in POST failures or degraded feature support.
• The LGA 4189 socket is generation-locked to 3rd Gen Xeon Scalable (Ice Lake-SP); procurement teams should confirm they are sourcing SR630 V2 chassis specifically — the V1 uses LGA 3647 and is not compatible with this processor option.

This processor option is a strong fit for enterprise environments deploying the SR630 V2 as a consolidation platform — particularly where a 1U footprint, sub-200W per-socket power draw, and 24-thread compute capacity need to coexist in a constrained rack environment running 24/7 compute workloads such as video analytics or virtualized security infrastructure.