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Overview

SKU: 4XG7A09047
UPC: 889488459209
Condition: New
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Lenovo 4XG7A09047 SR590 Xeon 5115 10C/85W/2.4GHZ

Lenovo 4XG7A09047 Xeon Gold 5115 10-Core Processor Option for ThinkSystem SR590OverviewThe Lenovo 4XG7A09047 is a factory-new Intel Xeon Gold 5115 pro…

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Lenovo 4XG7A09047 SR590 Xeon 5115 10C/85W/2.4GHZ

$2,019.00
$1,948.99

Overview

SKU: 4XG7A09047
UPC: 889488459209
Condition: New

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Description

Lenovo 4XG7A09047 Xeon Gold 5115 10-Core Processor Option for ThinkSystem SR590

Overview

The Lenovo 4XG7A09047 is a factory-new Intel Xeon Gold 5115 processor option kit designed for the ThinkSystem SR590 server platform. Rated at 10 cores, 20 threads, and a 2.4 GHz base clock with a 3.2 GHz Turbo Boost ceiling, this processor targets compute-dense workloads — video management software stacks, multi-stream analytics engines, virtualized security infrastructure, and enterprise data processing — where per-core throughput and memory bandwidth matter more than raw clock speed. Built on Intel's 14 nm Skylake microarchitecture (Stepping H0), it occupies the LGA 3647 (Socket P) platform shared across the first-generation Xeon Scalable family, giving SR590 administrators a straightforward upgrade or second-socket configuration path without a motherboard swap.

Explore the full Lenovo server components and options catalog for compatible accessories and upgrade kits.

Key Features

  • 10 Cores / 20 Threads at 2.4–3.2 GHz: The 10-core / 20-thread configuration handles parallelized workloads efficiently — a VMS server running 64-channel decode with concurrent motion analytics will distribute thread load across all 20 logical processors rather than saturating a lower core count part. The 3.2 GHz Turbo Boost ceiling means single-threaded operations (database queries, license-plate recognition inference pipelines) still execute fast.
  • 85W TDP with Cooler Included: The 85W Thermal Design Power sits in the mid-range for the Gold 5100 series, which matters for SR590 chassis power budgeting in dense rack environments. The included cooler eliminates a separate procurement step and ensures Lenovo-validated thermal performance out of the box — no guessing on heatsink compatibility with the SR590 socket and chassis airflow path.
  • 13.75 MB L3 Cache: The 13.75 MB L3 cache reduces main memory round-trips for working datasets that fit within the cache window — relevant for analytics inference loops that repeatedly reference a bounded model or lookup table, keeping latency low without taxing memory bandwidth.
  • Up to 768 GB Maximum Supported Memory: The processor supports up to 768 GB of addressable RAM across the SR590's DIMM slots. For virtualized deployments running multiple VMS instances, SOC workloads, or in-memory databases alongside surveillance services, this headroom means you can provision memory to workload without hitting a processor-side ceiling.
  • LGA 3647 (Socket P) — First-Gen Scalable Platform: Compatibility is scoped to the first-generation Intel Xeon Scalable platform. In an SR590 deployment, this means the 4XG7A09047 slots into either processor socket, enabling a dual-socket configuration that effectively doubles core count, memory channels, and PCIe lanes available to the system — useful when a single-socket SR590 starts hitting I/O or core saturation.
  • 64-bit Operating Mode, 14 nm Skylake: The Skylake architecture with H0 stepping is a mature, well-supported silicon revision with stable firmware and broad OS compatibility. For enterprise deployments where driver and hypervisor certification matters, a known-good stepping avoids the early-silicon errata risks that occasionally affect newer revisions.
  • Compact Processor Kit Dimensions (10.70 × 8.60 × 7.50 in, 2.95 lb): The packaged weight of 2.95 lb is standard for a boxed LGA 3647 processor kit with cooler. Plan rack access accordingly during installation — the cooler assembly requires deliberate seating and torque sequencing per Lenovo's SR590 service documentation.

Integration & Compatibility

The 4XG7A09047 is a component-for-server/workstation option, specifically validated for the Lenovo ThinkSystem SR590 platform. It occupies the LGA 3647 Socket P interface and operates within the first-generation Intel Xeon Scalable ecosystem. If the SR590 is already populated with a single Xeon Scalable processor, this kit can provision the second socket — doubling available compute without a chassis replacement. Verify your SR590's current firmware revision against Lenovo's compatibility matrix before installation; first-gen Scalable processors require UEFI firmware that pre-dates second-gen Scalable support, and mixing generations in the same chassis is not supported.

For supporting infrastructure, review available rack server options and consider pairing with additional memory DIMMs if provisioning the second socket — a dual-socket SR590 will benefit from a balanced memory population across both processors' memory channels. See the PoE switch category if this server is anchoring a surveillance network requiring edge-device power delivery planning.

For workloads involving video analytics or VMS platforms, the 20-thread compute profile pairs well with GPU accelerator options in the SR590's PCIe slots — the Xeon Gold 5115's PCIe lane allocation supports multi-card configurations without lane starvation at x8 per slot.

Frequently Asked Questions

Q: What server is the Lenovo 4XG7A09047 compatible with?

A: The 4XG7A09047 is a processor option kit validated for the Lenovo ThinkSystem SR590. It uses the LGA 3647 (Socket P) interface and is part of the first-generation Intel Xeon Scalable platform. Compatibility with other ThinkSystem models should be verified against Lenovo's official compatibility matrix.

Q: Does the 4XG7A09047 include a cooler?

A: Yes. A cooler is included with the 4XG7A09047 processor kit, per the verified specification data. No separate heatsink procurement is required for standard SR590 installation.

Q: What is the Turbo Boost frequency for the Xeon Gold 5115?

A: The Intel Xeon Gold 5115 in the 4XG7A09047 has a base frequency of 2.4 GHz and a maximum Turbo Boost frequency of 3.2 GHz, across its 10 cores and 20 threads.

Q: How much memory does the 4XG7A09047 support?

A: The Intel Xeon Gold 5115 processor supports a maximum of 768 GB of internal memory, subject to the SR590 platform's DIMM slot configuration and supported memory types.

Q: Can the 4XG7A09047 be used to populate a second processor socket in the SR590?

A: Yes. The ThinkSystem SR590 is a dual-socket platform. If the system is currently running a single first-generation Xeon Scalable processor, the 4XG7A09047 can be installed in the second LGA 3647 socket to expand compute capacity. Both sockets must use first-generation Xeon Scalable processors — second-generation processors are not cross-compatible in the same chassis.

Q: What is the TDP of the Xeon Gold 5115 in this kit?

A: The Thermal Design Power (TDP) is 85W. This is within the mid-range for the Gold 5100 series and is relevant for rack power budgeting, particularly in dual-socket or high-density SR590 deployments.

Eden Phillips
Eden Phillips

The 4XG7A09047 is the right call when you're scaling a ThinkSystem SR590 deployment and need more headroom without replacing hardware — the Xeon Gold 5115's 10 cores at 85W TDP sits at a practical mid-point for SR590 builds running multi-channel VMS decode alongside virtualized workloads. I've seen single-socket SR590s hit CPU saturation on 64+ channel deployments running motion analytics concurrently; dropping this kit into the second socket essentially doubles the available thread count with a predictable power cost.

Technical Highlights:

  • 2.4–3.2 GHz Turbo on 20 Threads: The combination of base and boost means sustained parallel workloads (multi-stream decode, concurrent analytics) run efficiently at base, while bursty single-threaded tasks — alarm event processing, database writes — step up to 3.2 GHz automatically without manual configuration.
  • 768 GB Max Addressable Memory: In a dual-socket SR590, both processors' memory controllers operate independently across separate DIMM banks. Populating both sockets allows full utilization of the SR590's DIMM slots, giving virtualized VMS environments room to allocate large memory partitions per VM without contention.
  • Cooler Included, 85W TDP: The included cooler is validated for the SR590 chassis airflow path. At 85W TDP, a dual-socket configuration draws 170W from processor TDP alone — worth accounting for in PDU capacity planning on dense racks where GPU cards or storage backplanes also contribute significant thermal load.

Deployment Considerations:

  • Before installation, confirm the SR590's UEFI firmware supports the H0 stepping of the Skylake Xeon Gold 5115 — earlier firmware revisions may require an update before the system POSTs with this processor installed.
  • The 4XG7A09047 is first-generation Xeon Scalable only. Do not mix with second-generation (Cascade Lake) processors in the same SR590 chassis — the platform does not support cross-generation dual-socket configurations.

This processor option is a strong fit for SR590 deployments supporting large-scale IP surveillance infrastructure — specifically environments running 64-channel or higher VMS instances with concurrent analytics where an existing single-socket build is approaching CPU saturation.

Specifications
Weight: 2.95 lb
Dimensions: 10.70 x 8.60 x 7.50 in (L x W x H)
Country Origin: MX
Country Of Origin: MX
Unspsc Code: 43201503
Processor generation: 1st Generation Intel® Xeon® Scalable
Processor model: 5115
Processor base frequency: 2.4 GHz
Processor family: Intel® Xeon® Gold
Processor cores: 10
Processor socket: LGA 3647 (Socket P)
Component for: Server/workstation
Processor lithography: 14 nm
Processor threads: 20
Processor operating modes: 64-bit
Processor boost frequency: 3.2 GHz
Processor cache: 13.75 MB
Processor cache type: L3
Thermal Design Power (TDP: 85 W
Cooler included: Yes
Stepping: H0
Processor codename: Skylake
Maximum internal memory supported by processor: 768 GB
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