Lenovo 4F17B08864 SR850 V4 Performance FAN Module KIT

Lenovo 4F17B08864 SR850 V4 Performance Fan Module Kit

Overview

The Lenovo 4F17B08864 is a performance fan module kit designed as a direct replacement or capacity expansion component for the ThinkSystem SR850 V4 rack server platform. When airflow capacity drops due to a failed or degraded fan module — or when adding high-TDP processors and PCIe cards that push thermal envelopes — swapping in the 4F17B08864 restores the chassis cooling headroom required to sustain full CPU and memory throughput without throttling. At 10 lb, this is a multi-module kit rather than a single fan unit, suited for a complete cooling refresh or initial population of a partially-configured chassis.

Compatibility

Designed for the Lenovo ThinkSystem SR850 V4 4-socket 2U rack server. Verify your chassis generation before ordering — the SR850 V4 fan bay geometry and connector pinout differ from the prior SR850 V2 generation; modules are not cross-compatible between generations. If your deployment spans multiple SR850 generations, confirm the target chassis model number against Lenovo's hardware maintenance manual for the V4 generation before installation.

Installation Notes

Fan module kits for the SR850 V4 are hot-swap capable under normal operating conditions — consult the Lenovo ThinkSystem SR850 V4 maintenance guide for the minimum number of active fan modules required before removing a unit in a live chassis. Depopulating below the minimum threshold triggers an immediate thermal protection response and may force an emergency shutdown. No special tooling is required for individual module swap; the kit weight of 10 lb reflects multi-module packaging — handle accordingly during rack-side staging.