HPE P48817-B21 Max Performance Heat Sink Kit

Overview

The HPE P48817-B21 is the Max Performance heat sink kit for the ProLiant DL380 Gen11 server platform. When a DL380 Gen11 is configured with high-TDP processors — typically processors that exceed the standard thermal envelope — the standard heat sink is insufficient to maintain safe operating temperatures under sustained load. The P48817-B21 replaces the standard cooler with a larger, higher-capacity heat sink assembly designed to keep processor junction temperatures within spec during continuous compute workloads. If you are populating both processor sockets with high-core-count or high-wattage CPUs, verify that both sockets receive the correct heat sink variant; mismatched coolers can trigger thermal throttling or BIOS POST warnings that reduce overall system performance. Weighing 6.08 lb, this is a heavier assembly than the standard kit — account for that during chassis handling and rack installation.

Compatibility

The P48817-B21 is designed for the HPE ProLiant DL380 Gen11 platform. It is specific to Gen11 and is not cross-compatible with DL380 Gen10 or Gen10 Plus chassis, which use different socket infrastructure and cooling brackets. Before ordering, confirm your processor's TDP against HPE's QuickSpecs for the DL380 Gen11 to verify whether the Max Performance variant is required — not all Gen11 CPU options mandate this kit. For multi-processor configurations on server components and thermal accessories, both installed processors should use the same heat sink class.

Installation Notes

Installation follows standard HPE ProLiant processor and heat sink replacement procedures. The chassis must be powered down and cooled before removal of any existing heat sink. Thermal interface material (TIM) application to the processor IHS is required; do not reuse existing TIM. Follow HPE's torque sequence for heat sink retention screws — uneven seating will result in inadequate contact and thermal performance degradation. Refer to the DL380 Gen11 Maintenance and Service Guide for step-by-step disassembly and reassembly procedures specific to this platform.