Lenovo 4XG7A96809 SR630 V4 6780E 144C 330W 2.2GHZ

Lenovo 4XG7A96809 Intel Xeon 6780E 144-Core Processor Option for SR630 V4

Overview

The Lenovo 4XG7A96809 is a factory-configured processor option kit that installs the Intel Xeon 6780E into the Lenovo ThinkSystem SR630 V4 rack server platform. With 144 cores running at a 2.2 GHz base frequency and a 3 GHz boost, this is a high-density compute processor aimed at workloads that scale horizontally across threads — think virtualization hosts running dozens of concurrent VMs, AI inference pipelines, or high-throughput data processing tasks where core count matters more than single-thread clock speed.

Built on Intel's 3 nm process node and socketed to the LGA 4710 interface, the 6780E supports octa-channel DDR5 memory at 6400 MHz with a platform ceiling of 4 TB RAM. That memory bandwidth and capacity headroom is what separates this class of processor from mainstream server SKUs — it's the combination that makes large in-memory datasets viable without hitting NUMA boundaries constantly.

Key Features

• 144 Cores / 144 Threads at 2.2 GHz Base: At this core count, the 6780E is built for parallelism. Workloads that spawn hundreds of concurrent threads — container orchestration, media transcoding at scale, large-scale video analytics — consume those cores directly without the scheduling contention you'd see on a lower-count processor. Boost headroom to 3 GHz means lightly-threaded bursts don't stall waiting for clock speed.
• 3 nm Intel Process Node: The jump to 3 nm improves power efficiency per core relative to prior-generation silicon. At 144 cores, that efficiency gain translates into meaningful thermal and power budget differences at the rack level. A 330W TDP across 144 cores works out to roughly 2.3W per core — reasonable density for dual-socket SR630 V4 configurations.
• 330W Thermal Design Power: At 330W, this processor requires active thermal management — Lenovo notes no cooler is included in the 4XG7A96809 kit, so confirm your SR630 V4 chassis has the appropriate heatsink and airflow configuration provisioned before deploying. Rack PDU planning should account for this draw per socket.
• Octa-Channel DDR5-6400 Memory: Eight memory channels running at 6400 MHz deliver the bandwidth that prevents the CPU from being memory-starved on throughput-intensive workloads. For large AI model inference or database query engines, the difference between quad- and octa-channel memory is often the actual throughput bottleneck — this platform removes it.
• 4 TB Maximum Memory Capacity: Support for up to 4 TB of RAM per processor socket is a decisive factor for in-memory databases, large-scale VMware or Hyper-V estates, or SAP HANA instances. Hitting 4 TB requires high-density RDIMM or MRDIMM population, so slot count and memory SKU planning must happen at the same time as processor selection.
• 108 MB L3 Cache: The large on-die cache reduces DRAM round-trips for working datasets that fit within it. For workloads with identifiable hot data — certain analytics engines, caching tiers, frequently-accessed VM guest memory — 108 MB of L3 meaningfully reduces effective latency versus processors with smaller cache footprints.
• Intel UPI at 24 GT/s: In dual-socket configurations, the 24 GT/s UPI interconnect governs cross-socket memory and cache coherency traffic. Higher UPI bandwidth reduces NUMA penalties when workloads access memory on the remote socket — relevant for any application that doesn't pin cleanly to a single NUMA node.
• 64-bit Operating Modes: Full 64-bit instruction support is standard for this class, but worth confirming for any legacy application stack that requires specific ISA extensions. The 6780E supports the full modern x86-64 instruction set compatible with current enterprise Linux and Windows Server distributions.

Integration and Compatibility

The 4XG7A96809 is a Lenovo ThinkSystem factory option kit engineered specifically for the SR630 V4 platform. Compatibility outside the SR630 V4 is not supported by this part number — the LGA 4710 socket is Xeon 6 generation-specific, and the processor requires the SR630 V4's voltage regulation and firmware revision to initialize correctly. Pair it with appropriate DDR5 server memory modules qualified for the SR630 V4; Lenovo's ServerProven compatibility list is the authoritative source for validated DIMMs.

From a software stack standpoint, the 6780E is supported by current versions of VMware vSphere, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, and Windows Server 2022 and later. Workloads running on high-throughput network infrastructure benefit from pairing this platform with 25GbE or higher NICs to prevent network bandwidth from becoming the constraint that the processor can outrun.

Country of origin is Mexico (MX), and the product ships under UNSPSC code 43211502 (electronic components and supplies).

Frequently Asked Questions

Q: Does the Lenovo 4XG7A96809 include a heatsink or cooler?

A: No. The 4XG7A96809 is a processor-only option kit. The SR630 V4 heatsink must be ordered separately and provisioned to match the 330W TDP of the Xeon 6780E. Verify the appropriate heatsink SKU with Lenovo's SR630 V4 configuration guide before ordering.

Q: What server platform is the 4XG7A96809 designed for?

A: This processor option is engineered specifically for the Lenovo ThinkSystem SR630 V4. The Xeon 6780E uses the LGA 4710 socket, which is exclusive to the Xeon 6 generation platform and is not compatible with prior SR630 chassis.

Q: What memory type and speed does the Xeon 6780E in the 4XG7A96809 support?

A: The 6780E supports DDR5-SDRAM at up to 6400 MHz across eight memory channels, with a maximum platform memory capacity of 4 TB. Achieving 4 TB requires high-density DIMM population; consult the SR630 V4 memory configuration guide for supported DIMM types and slot pairing rules.

Q: How many cores and threads does the 4XG7A96809 processor provide?

A: The Intel Xeon 6780E delivers 144 cores and 144 threads at a 2.2 GHz base frequency with a 3 GHz boost frequency.

Q: What is the TDP of the Xeon 6780E in the 4XG7A96809?

A: The Thermal Design Power is 330W. This must be accounted for in rack PDU planning, cooling airflow configuration, and heatsink selection for the SR630 V4 chassis.

Q: What is the country of origin for the 4XG7A96809?

A: The 4XG7A96809 is manufactured in Mexico (MX).

James Everett

The 4XG7A96809 is one of those processor options that changes the architecture conversation for an SR630 V4 deployment. When you're looking at 144 cores on a single socket with a 330W TDP ceiling, you're not picking this for a general-purpose workload mix — you're picking it because your application's thread count has outgrown what a 32- or 64-core processor can offer, and you need a platform that scales linearly with that parallelism.

Technical Highlights:

• 144 Cores at 3 nm: The Xeon 6780E packs 144 physical cores onto a single die using Intel's 3 nm process, achieving roughly 2.3W per core at TDP. That efficiency ratio matters when you're budgeting power and cooling for a dense rack — prior-generation 60-core processors at similar TDPs left less room for this kind of core density.
• Octa-Channel DDR5-6400: Eight memory channels at 6400 MHz is the bandwidth story here. For workloads like large-model AI inference, in-memory OLAP, or high-concurrency database engines, the difference between four and eight channels at this frequency can be the difference between the processor being compute-bound versus memory-bandwidth-bound.
• 24 GT/s Intel UPI: In a dual-socket SR630 V4 configuration, the UPI interconnect at 24 GT/s governs how efficiently the two sockets share cache state. For workloads that can't be cleanly NUMA-pinned — mixed-tenant virtualization environments being the common case — higher UPI bandwidth reduces the tax of remote memory access.

Deployment Considerations:

• No heatsink is included — this is a processor-only kit. The SR630 V4 heatsink selection is TDP-dependent, and at 330W you need to verify the correct performance heatsink SKU rather than defaulting to whatever ships with a lower-TDP base configuration. Getting this wrong means thermal throttling under sustained load.
• The 4 TB memory ceiling requires high-density DIMMs across all available slots. If your deployment doesn't need 4 TB now but might later, populate the slots in a way that leaves room for expansion without requiring a full DIMM swap — this affects your procurement plan at initial build.

The 4XG7A96809 is the right call for SR630 V4 deployments running high-concurrency containerized workloads, large-scale VMware estates where vCPU-to-core ratios matter, or AI inference pipelines where per-inference latency is acceptable but aggregate throughput needs to be very high. If your workload is primarily single-threaded or lightly-threaded, a lower core-count processor at higher base frequency will serve you better.