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SKU: 4XG7A63616
Condition: New
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Lenovo 4XG7A63616 SR665 Epyc 75F3

Lenovo 4XG7A63616 AMD EPYC 75F3 32-Core Processor for ThinkSystem SR665OverviewThe Lenovo 4XG7A63616 is AMD's EPYC 75F3 processor configured and valid…

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Lenovo 4XG7A63616 SR665 Epyc 75F3

$13,230.99

Overview

SKU: 4XG7A63616
Condition: New

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Description

Lenovo 4XG7A63616 AMD EPYC 75F3 32-Core Processor for ThinkSystem SR665

Overview

The Lenovo 4XG7A63616 is AMD's EPYC 75F3 processor configured and validated for the Lenovo ThinkSystem SR665 platform — a 32-core, 64-thread chip built specifically for compute-dense workloads where per-core performance matters more than raw core count. At 2.95 GHz base and 4 GHz boost on a 7 nm process node, the 75F3 occupies a deliberate position in the enterprise server processor lineup: fewer cores than AMD's highest-count EPYC parts, but with a significantly higher clock ceiling and a 256 MB L3 cache that keeps latency-sensitive workloads off main memory far longer than competing configurations. If you're sizing processors for video analytics servers, database engines, or large-scale NVR platforms where single-threaded responsiveness is a constraint, this is the variant to evaluate.

Key Features

  • 32 Cores / 64 Threads at 2.95 GHz Base: The 75F3 runs 32 physical cores with SMT enabled for 64 logical threads — enough parallelism to handle concurrent analytics streams or multi-tenant workloads without context-switch overhead degrading per-stream latency. The 2.95 GHz base clock is meaningfully higher than broader-core EPYC variants that sacrifice clock speed for core density.
  • 4 GHz Boost Frequency: When workloads aren't saturating all 32 cores simultaneously — which is typical for mixed analytics + management tasks — individual cores climb to 4 GHz. That's a 35% clock uplift over base, and it matters directly for any single-threaded bottleneck in your stack: database query planners, license managers, VMS event processors.
  • 256 MB L3 Cache: This is a defining characteristic of the 75F3. A 256 MB shared L3 pool means frequently accessed working sets — analytics model weights, frame buffers, index structures — stay on-die rather than round-tripping to DDR4. Expect measurably lower tail latency on cache-resident workloads compared to smaller-cache EPYC configurations.
  • 7 nm Process Node: TSMC 7 nm fabrication delivers the efficiency headroom that allows the 75F3 to sustain high clock rates at a 280 W TDP. In a dual-socket SR665 configuration, understanding per-socket TDP is essential for power supply and rack PDU sizing — plan for full 280 W per socket under sustained compute load.
  • Octa-Channel DDR4-3200 Memory: Eight independent DDR4-3200 memory channels deliver up to 204.8 GB/s of aggregate memory bandwidth. For workloads that can't fit in cache — large video frame queues, bulk analytics inference across high-resolution streams — this bandwidth prevents the memory bus from becoming your bottleneck. DDR4-3200 is the fastest DDR4 speed grade, so pair with appropriately rated RDIMMs to realize the full bandwidth figure.
  • Socket SP3 Interface: The 4XG7A63616 drops into the SR665's Socket SP3 socket. SP3 is a 4094-pin LGA interface supporting the full EPYC ecosystem — if you're planning a dual-processor SR665 build, both sockets are SP3, and both can carry the 75F3 for a 64-core/128-thread system configuration.
  • 64-Bit Operating Modes Only: The 75F3 is a 64-bit-native processor with no 32-bit compatibility mode. Every major enterprise OS and hypervisor in current production supports this without issue, but flag it if any legacy 32-bit workloads are in scope for the platform.
  • No Cooler Included: The 4XG7A63616 ships as a processor only — no heatsink or cooling solution is included. The ThinkSystem SR665 uses Lenovo's proprietary active cooling infrastructure, so the platform-supplied cooling is what you'll use. Verify your SR665 chassis cooling configuration supports a 280 W TDP processor before ordering.

Integration & Compatibility

The 4XG7A63616 is a Lenovo-validated option specifically for the ThinkSystem SR665 server platform. AMD EPYC third-generation (Milan) processors on Socket SP3 support PCIe 4.0 — relevant if you're pairing this system with high-throughput GPU accelerators or NVMe storage expansion cards for video analytics or AI inference workloads. The octa-channel memory architecture requires that DIMMs be populated per Lenovo's SR665 memory configuration guide to achieve rated bandwidth; asymmetric or partial population will reduce effective throughput. VMware ESXi, Red Hat Enterprise Linux, Windows Server, and Ubuntu LTS are all validated on the SR665 platform with EPYC Milan processors — confirm your specific OS version against Lenovo's ServerProven compatibility matrix before deployment.

Frequently Asked Questions

Q: What server platform is the Lenovo 4XG7A63616 designed for?

A: The 4XG7A63616 is validated for the Lenovo ThinkSystem SR665 server. It uses the Socket SP3 interface specific to AMD EPYC processors and is not cross-compatible with other socket types or server platforms.

Q: Does the 4XG7A63616 include a heatsink or cooling solution?

A: No. The processor ships without a cooler. The ThinkSystem SR665 uses Lenovo's integrated active cooling infrastructure. Ensure your SR665 chassis is configured to support the 280 W TDP of this processor before installation.

Q: What is the maximum memory bandwidth supported by the AMD EPYC 75F3?

A: The EPYC 75F3 supports up to 204.8 GB/s of aggregate memory bandwidth via eight DDR4-3200 memory channels. Achieving this figure requires full DIMM population at DDR4-3200 speed per Lenovo's memory configuration guidelines for the SR665.

Q: Can I install two 4XG7A63616 processors in a single SR665 chassis?

A: The ThinkSystem SR665 is a dual-socket platform. Installing two EPYC 75F3 processors yields a 64-core, 128-thread system with up to 409.6 GB/s combined memory bandwidth. Both sockets use the SP3 interface.

Q: What is the boost clock frequency of the AMD EPYC 75F3?

A: The EPYC 75F3 boosts to 4 GHz on lightly loaded cores, up from a 2.95 GHz base frequency — a 35% uplift that benefits single-threaded workloads such as database query planners, event processors, and license management services.

Q: How much L3 cache does the EPYC 75F3 provide?

A: The EPYC 75F3 provides 256 MB of shared L3 cache. This large on-die cache is a primary differentiator of the 75F3 versus lower-cache EPYC configurations and directly benefits latency-sensitive applications by reducing main memory access frequency.

Marty Allison
Marty Allison

The 4XG7A63616 is one of those processor configs I recommend when the conversation shifts from 'how many cores' to 'how fast are those cores.' The EPYC 75F3's 256 MB L3 cache at a 4 GHz boost is a specific engineering choice by AMD — they traded core count headroom to give each core significantly more on-die data access. For SR665 deployments running deep-learning video analytics or multi-stream forensic VMS workloads, that cache size keeps inference model weights resident and reduces the GPU-CPU data shuttle that kills frame throughput.

Technical Highlights:

  • 256 MB L3 Cache: At 256 MB, this is one of the largest on-die cache pools in the EPYC Milan family. Applications that fit their working set within cache see dramatically reduced memory latency — relevant for analytics engines, in-memory databases, and VMS indexing services where DDR4 round-trip latency would otherwise create processing gaps.
  • 204.8 GB/s Memory Bandwidth: Eight DDR4-3200 channels provide 204.8 GB/s aggregate — enough to sustain high-resolution video ingest from dozens of simultaneous camera streams without creating a memory bus bottleneck. This bandwidth figure assumes correctly populated RDIMMs at rated speed.
  • 280 W TDP at 7 nm: A 280 W TDP is substantial but manageable in the SR665's engineered thermal envelope. The 7 nm process is what makes that TDP viable at 4 GHz boost — an older process node at equivalent clock speeds would push well past 350 W. Rack power planning should budget 280 W per populated socket under sustained load.

Deployment Considerations:

  • No cooler ships with this SKU — the SR665's integrated cooling handles the 75F3, but verify your specific SR665 chassis cooling configuration is rated for a 280 W TDP processor before installation, particularly in high-ambient-temperature data center environments.
  • The octa-channel memory controller only delivers rated 204.8 GB/s bandwidth with full and correctly balanced DIMM population. Partial or asymmetric DIMM configurations will reduce effective bandwidth, sometimes significantly — follow Lenovo's SR665 memory population rules exactly.

For a dual-socket SR665 build running a VMS platform with GPU-accelerated analytics — think 100+ camera streams with concurrent motion search and license plate recognition — the 75F3's cache depth and per-core clock speed make it the right call over higher-core-count EPYC variants where the clock rate penalty would create analytics pipeline latency you'd feel under peak load.

Specifications
Weight: 10.00 lb
Unspsc Code: 43211600
Processor manufacturer: AMD
Processor model: 75F3
Processor base frequency: 2.95 GHz
Processor family: AMD EPYC
Processor cores: 32
Processor socket: Socket SP3
Processor lithography: 7 nm
Processor threads: 64
Processor operating modes: 64-bit
Processor boost frequency: 4 GHz
Processor cache: 256 MB
Processor cache type: L3
Thermal Design Power (TDP: 280 W
Cooler included: No
Memory types supported by processor: DDR4-SDRAM
Memory clock speeds supported by processor: 3200 MHz
Memory channels: Octa-channel
Memory bandwidth (max: 204.8 GB/s
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