Lenovo 4XG7A63448 SR650 V2 Platinum 8352V 36C 195W 2.1GHZ

Lenovo 4XG7A63448 Intel Xeon Platinum 8352V 36-Core Processor Option for ThinkSystem SR650 V2

Overview

The Lenovo 4XG7A63448 is a factory-configured processor option kit that drops a 3rd Generation Intel Xeon Platinum 8352V into a Lenovo ThinkSystem SR650 V2 server. The 8352V is a 36-core, 72-thread Ice Lake Xeon running at 2.1 GHz base with a 3.5 GHz boost, rated at 195W TDP — positioned squarely at compute-dense enterprise workloads where per-core throughput and large memory addressability matter more than raw clock speed. If you are sizing out a virtualization host, a high-density AI inference node, or a workload that needs to stay inside a single NUMA boundary while still scaling thread count, this processor tier is worth a close look. The 4XG7A63448 is sourced factory-new as a Lenovo-validated component, eliminating the compatibility and firmware risk that comes with third-party processor procurement.

Key Features

• 36 Cores / 72 Threads via Ice Lake Microarchitecture: The 8352V's 36-core count gives a virtualization host enough hardware threads to run dense VM stacks without contention. At 72 logical processors, a single SR650 V2 socket can absorb workloads that would have required a two-socket node in the prior generation — directly reducing per-VM licensing exposure on software priced per physical core.
• 2.1 GHz Base / 3.5 GHz Boost Frequency: The 1.4 GHz headroom between sustained and peak clocks means latency-sensitive tasks (database query execution, single-threaded compilation paths) get the boost budget they need, while sustained throughput workloads settle into the 2.1 GHz floor without thermal throttling under continuous load.
• 54 MB L3 Cache: The 54 MB last-level cache is large enough to hold working sets for mid-size in-memory databases and analytics engines on-die. Cache misses that would otherwise push to DRAM — adding 60–80 ns of latency — stay local. For latency-profiled applications, this is a meaningful architectural advantage over lower-tier Xeon SKUs with half the cache.
• 195W Thermal Design Power: At 195W TDP, this processor sits in the upper-mid range of the Ice Lake Platinum family. The SR650 V2 chassis is engineered to handle this envelope, but your data center power and cooling budget needs to account for it — particularly in a two-socket configuration where the chassis aggregate approaches 400W for processors alone before memory, drives, and NIC load are added.
• LGA 4189 Socket / 10 nm Ice Lake Lithography: The LGA 4189 socket is exclusive to 3rd Gen Xeon Scalable, meaning this processor is not forward- or backward-compatible with earlier SR650 (Cooper Lake / Cascade Lake) systems. Verify your server generation before ordering. The 10 nm node delivers improved instructions-per-clock over the 14 nm Cascade Lake generation, which matters for integer-heavy enterprise workloads.
• 11.2 GT/s UPI Interconnect: The Ultra Path Interconnect at 11.2 GT/s governs CPU-to-CPU bandwidth in a two-socket SR650 V2 configuration. For workloads with significant cross-socket memory access patterns — shared-memory HPC, distributed in-memory caches — this link determines whether NUMA latency becomes a bottleneck. A single-socket deployment eliminates UPI as a variable entirely.
• Up to 6 TB Maximum Memory Support: The 8352V's memory controller supports up to 6 TB of addressable RAM across the SR650 V2's DIMM slots. That ceiling is sufficient for in-memory OLAP engines, large-footprint SAP HANA deployments, and AI training datasets that need to reside fully in memory to avoid I/O-bound bottlenecks.
• 72 Hardware Threads / 64-bit Operating Mode: Full 64-bit operation across all 72 threads ensures compatibility with every current enterprise OS, hypervisor, and container runtime. There are no 32-bit compatibility compromises to manage.
• 3rd Gen Xeon Scalable / Intel Xeon Platinum 8000 Series Positioning: The Platinum 8000 series sits at the top of the Xeon Scalable hierarchy. Compared to Gold-tier options, Platinum SKUs carry higher core counts, larger caches, and in some cases wider memory channel support — relevant when you are deciding between processor tiers during a server configuration. For the SR650 V2 platform, the 8352V is a high-core-count option without reaching into the extreme TDP range of the highest-end Platinum SKUs.

Integration & Compatibility

The 4XG7A63448 is validated exclusively for the Lenovo ThinkSystem SR650 V2. It will not fit or function in the original SR650 (V1), which uses a different socket generation. Before ordering, confirm your chassis is a genuine V2 — the bill of materials and model placard on the chassis bezel are the authoritative sources, not the product name on your procurement order. This processor kit is a Lenovo-validated option, meaning firmware compatibility, fan zone tuning, and thermal algorithms in the baseboard management controller are pre-aligned to this specific CPU SKU. That alignment matters: mismatched processor-to-platform configurations can result in reduced boost headroom, incorrect power capping, or outright POST failure. For environments running high-throughput network infrastructure alongside compute, pair the SR650 V2 with appropriate NIC and storage solutions that match the processor's memory bandwidth capabilities. The 8352V's Ice Lake architecture supports Intel DL Boost (VNNI instructions), which accelerates INT8 inference workloads without requiring a discrete accelerator card — relevant if you are evaluating this platform for edge AI inference or video analytics at scale. For full memory population guidance and supported DIMM configurations for this processor, reference Lenovo's ServerProven compatibility tool with the SR650 V2 machine type.

Frequently Asked Questions

Q: Is the Lenovo 4XG7A63448 compatible with the original ThinkSystem SR650 (V1)?

A: No. The 4XG7A63448 uses the LGA 4189 socket, which is exclusive to the ThinkSystem SR650 V2 and other 3rd Generation Intel Xeon Scalable platforms. The original SR650 uses a different socket generation (LGA 3647) and is not compatible with this processor.

Q: What is the boost clock speed of the Intel Xeon Platinum 8352V in this kit?

A: The 8352V boosts to 3.5 GHz from a 2.1 GHz base frequency. The 1.4 GHz headroom is available for single- or lightly-threaded workloads where the thermal and power budget permits the processor to clock up.

Q: How much memory can the SR650 V2 support with this processor installed?

A: The Intel Xeon Platinum 8352V supports up to 6 TB of maximum addressable memory. Actual installed capacity depends on the DIMM configuration and slots populated in the SR650 V2 chassis.

Q: Does the 8352V support Intel DL Boost for AI and inference workloads?

A: Yes. As a 3rd Generation Intel Xeon Scalable (Ice Lake) processor, the 8352V includes Intel DL Boost with VNNI (Vector Neural Network Instructions), which accelerates INT8 deep learning inference without requiring a discrete GPU or accelerator card.

Q: What is the TDP of the 8352V and what does that mean for data center power planning?

A: The Thermal Design Power is 195W. In a dual-socket SR650 V2, processor-only draw approaches 390W before memory, drives, and adapters are added. Data center power and cooling budgets should account for the full chassis TDP, not processor TDP alone.

Q: Is the 4XG7A63448 a genuine Lenovo part or a third-party processor?

A: The 4XG7A63448 is a genuine Lenovo option kit sourced factory-new through distribution. It is not a third-party or grey-market component, which ensures firmware alignment and platform validation with the SR650 V2 baseboard management controller.

James Everett

The 4XG7A63448 is the processor option I reach for when a customer needs to maximize thread count in a single SR650 V2 socket without pushing into the highest TDP bracket. Thirty-six cores at 195W is a reasonable thermal contract for a 2U chassis — you get the compute density without forcing a cooling infrastructure upgrade in most enterprise data centers.

Technical Highlights:

• 36 Cores / 54 MB L3 Cache: The cache-to-core ratio here is 1.5 MB per core — enough that virtualization workloads with reasonable working set sizes stay off DRAM for most operations. That translates to lower latency per VM and better consolidation ratios than you get from lower-cache Gold-tier SKUs at similar core counts.
• 3.5 GHz Turbo / 11.2 GT/s UPI: The 1.4 GHz boost range means this processor handles mixed workload profiles well — sustained throughput at 2.1 GHz plus headroom for burst. In a two-socket SR650 V2, the 11.2 GT/s UPI link is the ceiling for cross-socket memory bandwidth; design your workloads to be NUMA-local if inter-socket traffic is a concern.
• 6 TB Max Memory Addressability: At 6 TB addressable, this processor supports in-memory database deployments and large analytics workloads that would require expensive NVMe tiering on lower-ceiling platforms. It is the architectural headroom that makes the 8352V worth the premium over Gold-tier options in memory-bound use cases.

Deployment Considerations:

• Confirm chassis generation before ordering — LGA 4189 is SR650 V2 only. An SR650 V1 on your rack will not accept this processor and the sockets are physically incompatible, so there is no risk of an accidental insertion, but the procurement error is costly and non-returnable in most configurations.
• At 195W TDP per socket, thermal management in a high-density rack needs active planning. If you are targeting dual-socket density at full rack utilization, verify your CRAC or in-row cooling unit has headroom for the combined processor, memory, and NIC thermal load — not just the processor TDP in isolation.

For enterprise virtualization hosts, high-density AI inference nodes running INT8 workloads via Intel DL Boost, or SAP HANA scale-up deployments where a single NUMA domain needs both thread count and large memory addressability, the 8352V in the SR650 V2 is a well-matched combination that avoids the thermal and cost premium of the highest-end Platinum SKUs while still delivering Platinum-tier core counts.