Lenovo 4XG7A38075 SR650 Xeon Gold 6250

Lenovo 4XG7A38075 Intel Xeon Gold 6250 8-Core Server Processor

Overview

The Lenovo 4XG7A38075 is a factory-new Intel Xeon Gold 6250 processor designed for installation in the Lenovo ThinkSystem SR650 server platform. Rated at 3.9 GHz base with a 4.5 GHz Turbo Boost ceiling and built on Intel's 2nd Generation Xeon Scalable (Cascade Lake) architecture, this 8-core, 16-thread processor targets compute-dense workloads where single-threaded performance matters as much as core count — think database query engines, ERP back-ends, and latency-sensitive virtualization hosts. It arrives as a tray-format component without a cooler, suited for integrators provisioning SR650 nodes to spec.

Key Features

• 3.9 GHz Base / 4.5 GHz Boost Clock: The 6250's high base frequency is a deliberate trade-off — fewer cores clocked harder rather than many cores clocked conservatively. For workloads that don't parallelize well (single-threaded application logic, legacy ERP modules, transactional databases), this translates directly to lower per-query latency compared to higher-core-count Xeon Gold SKUs running at 2.6–3.1 GHz base. The 4.5 GHz Turbo headroom means burst-sensitive tasks — report generation, batch transforms — finish faster without sustained multi-core saturation.
• 8 Cores / 16 Threads: Sixteen logical processors give the hypervisor enough scheduling headroom to run 8–12 VMs without heavy contention on a moderately utilized host. For SR650 dual-socket configurations, pairing two 4XG7A38075 units delivers 16 physical cores and 32 threads — a practical ceiling for mid-size virtualization clusters where per-VM vCPU assignments rarely exceed 4.
• 35.75 MB Intel Smart Cache: The large L3 cache reduces main-memory round-trips on data-intensive workloads. In server component terms, this is especially relevant for in-memory analytics and database buffer pools — a working dataset that fits in cache avoids DRAM latency entirely, which at DDR4-2933 speeds is roughly a 4–5× latency difference.
• 185W TDP: At 185 watts thermal design power, this processor sits at the upper end of the Xeon Gold 6200 family's power envelope. Plan your SR650 chassis power budget accordingly — dual-socket configurations with two 4XG7A38075 CPUs, full DIMM populations, and NVMe storage can approach 600–700W under load. Specify SR650 power supply units and PDU circuits with adequate headroom before procurement.
• LGA 3647 (Socket P) — Cascade Lake Architecture: The LGA 3647 socket is the standard mounting interface for 2nd Gen Intel Xeon Scalable processors in the SR650 platform. Cascade Lake brings hardware-level mitigations for Spectre/Meltdown variants baked into silicon, reducing the performance overhead those mitigations impose when applied in software on earlier Skylake-SP silicon. For security-hardened deployments, this is a meaningful practical difference.
• 14nm Process / 64-bit Operating Mode: The mature 14nm node provides a well-understood reliability and thermal profile. All major enterprise operating systems — RHEL, Windows Server, VMware ESXi — run natively in 64-bit mode, with no workload classification constraints.
• Tray Package — No Cooler Included: The tray format means the processor ships without a retail heatsink. The SR650's active cooling solution is supplied by the chassis itself — this is correct for data center blade and rack integration, but confirm your SR650 configuration includes the appropriate fan and heatsink assembly before ordering, particularly for high-ambient or high-density rack environments.

Integration & Compatibility

The 4XG7A38075 is sourced and sold as a Lenovo option part, meaning it is validated specifically for the ThinkSystem SR650 platform under Lenovo's configuration matrix. Installing third-party or non-Lenovo-validated processors in ThinkSystem servers may trigger firmware compatibility flags or void platform support — use Lenovo option parts to maintain full platform support status. The SR650 supports dual-socket configurations, so a second 4XG7A38075 can be added to maximize core density within the same chassis.

From a workload perspective, this processor integrates cleanly with VMware vSphere, Microsoft Hyper-V, and KVM-based hypervisors. Its AVX-512 instruction set support benefits AI inference and HPC workloads that leverage Intel's vector extensions. Memory: the SR650 with Xeon Gold 6250 supports DDR4-2933 DIMMs — pair with appropriately validated Lenovo RDIMM or LRDIMM option parts for full-speed operation. For system-level deployment guidance, consult a server configuration guide to align CPU, memory, and storage selections before provisioning.

This processor carries Intel ARK ID 198652, which references the full specification sheet on Intel's product documentation. The UNSPSC classification code is 43201503 (Microprocessors), which simplifies procurement categorization for organizations using UNSPSC-coded purchasing systems. For broader Lenovo server components including memory, storage, and networking add-ins for the SR650, see the full component catalog.

Frequently Asked Questions

Q: Is the Lenovo 4XG7A38075 compatible with the ThinkSystem SR650?

A: Yes. The 4XG7A38075 is a Lenovo option part validated for the ThinkSystem SR650 server platform. It uses the LGA 3647 (Socket P) interface required by the SR650's 2nd Gen Intel Xeon Scalable CPU slots.

Q: Does the 4XG7A38075 include a heatsink or cooler?

A: No. This is a tray-format processor and does not include a cooler. The SR650 provides its own chassis-integrated cooling solution. Confirm your SR650 configuration includes the appropriate heatsink assembly before installing this processor.

Q: Can the SR650 run two 4XG7A38075 processors in a dual-socket configuration?

A: Yes. The ThinkSystem SR650 supports dual-socket operation. Installing a second 4XG7A38075 doubles the physical core and thread count to 16 cores and 32 threads, which is beneficial for virtualization density and multi-threaded workloads.

Q: What is the base and boost clock speed of the Xeon Gold 6250?

A: The Intel Xeon Gold 6250 (4XG7A38075) runs at 3.9 GHz base frequency with a maximum Turbo Boost frequency of 4.5 GHz. This makes it well-suited for workloads that benefit from high single-threaded performance.

Q: What is the TDP of this processor and what does it mean for power planning?

A: The Xeon Gold 6250 has a 185W TDP. In a dual-socket SR650 configuration with full memory and storage, total system draw under load can approach 600–700W. Size your power supplies and PDU circuits accordingly before deployment.

Q: What generation architecture is the Xeon Gold 6250?

A: The 4XG7A38075 is based on Intel's 2nd Generation Xeon Scalable (Cascade Lake) architecture, which includes silicon-level mitigations for Spectre and Meltdown vulnerability variants — reducing the performance penalty those mitigations carry when handled purely in software on older Skylake-SP silicon.

Jerry Tildsen

The 4XG7A38075 is one of the few Xeon Gold SKUs I recommend when the conversation starts with 'our workload doesn't parallelize well.' The 3.9 GHz base on the Gold 6250 is 400–700 MHz higher than most of the high-core-count Gold options at the same tier — and for transactional databases or single-threaded ERP processes, that gap shows up in real response times, not just benchmark sheets.

Technical Highlights:

• 4.5 GHz Turbo Boost: Burst headroom that most workloads hit constantly — report generation, batch jobs, ad-hoc queries. The 600 MHz gap between base and boost is wide enough to matter for latency-sensitive tasks without requiring sustained all-core saturation.
• 35.75 MB L3 Cache: Large enough to keep frequently accessed database buffer pools and in-memory analytics datasets resident without DRAM round-trips — measurable improvement for read-heavy OLTP workloads with predictable access patterns.
• Cascade Lake Silicon Mitigations: Hardware-level Spectre/Meltdown mitigations mean you don't pay the 10–30% software-patching overhead that Skylake-SP systems incurred post-disclosure. On a server running dozens of VMs, that overhead compounds — this generation recovers it at the silicon level.

Deployment Considerations:

• At 185W TDP, this processor runs hot relative to lower-clocked Gold options. In high-density SR650 rack deployments, verify your row-level cooling capacity before stacking dual-socket nodes — chassis fan curves may need adjustment for sustained compute workloads in warm aisles.
• Tray format means no heatsink in the box. This is correct for SR650 integration (the chassis supplies cooling), but if you're staging outside the chassis for any reason, handle the processor carefully — there is no retention frame or thermal interface protection included.

This processor fits a specific deployment profile: mid-size virtualization hosts or database servers where per-core performance is the bottleneck, the workload isn't embarrassingly parallel, and the team needs a validated Lenovo option part for SR650 platform support. It's not the right pick for Hadoop clusters or highly threaded rendering farms — but for the right workload, it's a deliberate, well-reasoned selection.