Lenovo 4H47A85030 SR630 V3 1U Performance HS

Lenovo 4H47A85030 SR630 V3 1U Performance Heatsink

Overview

The Lenovo 4H47A85030 is a performance heatsink designed for the ThinkSystem SR630 V3 1U rack server. If you are speccing or servicing an SR630 V3 and need to upgrade the thermal solution — whether for a higher-TDP processor configuration or a replacement — this is the part to source. At 10 lb, the heatsink is a substantial assembly built to handle the thermal demands of performance-class Xeon processors in a dense 1U chassis. Manufactured in Mexico and sourced through commercial distribution channels, the 4H47A85030 is a factory-new, genuine Lenovo component.

Explore the broader Lenovo server and data center catalog or browse 1U rack servers for platform context before ordering.

Key Features

• 1U Form Factor Compatibility: Engineered specifically for the SR630 V3 chassis — a 1U dual-socket server. Heatsink geometry is constrained by the 1U envelope, so this is not interchangeable with SR630 V2 or other platform heatsinks. Verify the generation before ordering.
• Performance Thermal Rating: Designated as a performance heatsink (versus standard), meaning it is sized for higher-TDP processor options. If you are populating the SR630 V3 with mid-range Xeon configurations, confirm with Lenovo's processor compatibility matrix whether the performance HS is required or optional for your CPU TDP.
• 10 lb Shipping Weight: The 10 lb weight reflects a robust copper/aluminum fin stack — typical for a high-airflow 1U active heatsink. Budget for this in rack weight calculations when fully populating a chassis.
• Factory-New Genuine Component: Sourced through commercial distribution (UNSPSC 43201538 — computer hardware). Not a pull, not a refurb — relevant if you are maintaining warranty or support contract integrity on the server.

Integration and Compatibility

The 4H47A85030 is platform-specific to the ThinkSystem SR630 V3. Before ordering, cross-reference Lenovo's SR630 V3 parts compatibility guide for your specific processor TDP — Lenovo typically offers both standard and performance heatsink SKUs, and the wrong one will either not seat correctly or leave thermal headroom on the table. Pair with appropriate server cooling and airflow accessories for your rack environment.

Frequently Asked Questions

Q: Is the 4H47A85030 compatible with the SR630 V2?

A: Evidence does not confirm cross-generation compatibility. This part is designated for the SR630 V3. Consult Lenovo's official parts matrix before attempting to use it in an SR630 V2 chassis.

Q: Is this a standard or performance heatsink?

A: The product name designates this as a performance heatsink (HS), intended for higher-TDP processor configurations in the SR630 V3 1U platform.

Q: What is the country of origin for the 4H47A85030?

A: Mexico (MX), per distribution feed data.

Q: Is this a new component or a refurbished pull?

A: This is a factory-new, genuine Lenovo component sourced through commercial distribution channels — not a refurbished or pulled part.

Jerry Tildsen

The Lenovo 4H47A85030 is a platform-specific performance heatsink for the SR630 V3 — not a universal part. At 10 lb, this is a substantial thermal assembly, and the performance designation matters: Lenovo stratifies SR630 V3 heatsinks by processor TDP, so ordering the wrong tier means either a non-seating part or a thermal bottleneck on your CPU.

Technical Highlights:

• 1U Performance HS Designation: Sized for higher-TDP Xeon configurations inside the SR630 V3's constrained 1U airflow path — the standard heatsink will not handle the full thermal envelope of top-tier processor SKUs.
• 10 lb Assembly Weight: Indicates a full copper/aluminum fin stack with active airflow design — relevant for rack load calculations when fully populating a chassis with dual processors and dense NVMe.
• Factory-New Genuine Part: Sourced through commercial distribution under UNSPSC 43201538 — matters for organizations maintaining ThinkSystem support contracts where non-genuine parts can affect warranty status.

Deployment Considerations:

• Confirm the exact processor TDP against Lenovo's SR630 V3 heatsink selection guide before ordering — mixing standard and performance HS across dual-socket configurations is a documented field error.
• Evidence is limited to distribution feed attributes (weight, origin, form factor). For thermal specifications, airflow requirements, and full processor compatibility, reference Lenovo's SR630 V3 parts documentation directly.

Best fit for SR630 V3 deployments running high-core-count Xeon configurations in dense rack environments — data center rows or edge compute enclosures where proper thermal headroom directly affects CPU boost behavior and longevity.