HID 094052 Two Patch Material Lamination Module

HID 094052 Two Patch Material Lamination Module

The HID Two Patch Material Lamination Module enables targeted application of specialized overlaminates to specific card areas for enhanced security and functionality. This advanced module allows selective placement of security patches, holographic materials, or specialty overlaminates while maintaining efficient production workflows. The precision placement capability ensures accurate positioning of security features and functional elements such as contactless antennas or magnetic stripe areas. Compatible with HID lamination systems, this module provides flexibility for complex card designs requiring multiple material types. Ideal for high-security applications including government IDs, financial cards, and access credentials requiring sophisticated security features. The two-patch capability maximizes design flexibility while maintaining production efficiency for demanding card personalization requirements.